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论文共 77 篇作者统计合作学者相似作者

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Scalable Advanced DBHi Chiplet Package Using Silicon Bridge with 30 Μm-Pitch Solder Joints
Akihiro Horibe,Takahito Watanabe,Chinami Marushima,Sayuri Kohara,Yasuharu Yamada,Hiroyuki Mori,Divya Taneja, Katherine Pilger, Alexis Jacques-Fortin, Maxime Godard,Qianwen Chen,Eric Perfecto,Aakrati Jain, Joseph R. Ross,Thomas Wassick,Isabel de Sousa
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.269-273, (2024)
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Next Generation Co-Packaged Optics Technology to Train Run Generative AI Models in Data Centers and Other Computing Applications
John Knickerbocker,Jean Benoit Heroux, Griselda Bonilla, Hsiang Hsu, Neng Liu, Adrian Paz Ramos, Francois Arguin, Yan Tribodeau, Badr Terjani,Mark Schultz, Raghu Kiran Ganti, Linsong Chu,Chinami Marushima, Yoichi Taira,Sayuri Kohara,Akihiro Horibe,Hiroyuki Mori,Hidetoshi Numata
arxiv（2024）
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Direct Bonded Heterogeneous Integration (dbhi): Surface Bridge Approach for Die Tiling
Claudia Cristina Barrera Pulido,Sayuri Kohara,Aakrati Jain,Thomas Wassick,Divya Taneja, Philip McInnes,Akihiro Horibe,Isabel de Sousa
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1053-1059, (2023)
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Analysis of Process Dependent Mechanical Properties of Sintered Copper Nanoparticle Pillars for the Plating-Free Bumping by Finite Element Method
Sayuri Kohara,Toyohiro Aoki,Chinami Marushima, Christine Taylor,Kuniaki Sueoka,Takashi Hisada
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-8, (2022)
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作者统计

#Papers: 77

#Citation: 651

H-Index: 17

G-Index: 24

Sociability: 5

Diversity: 1

Activity: 0

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