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论文共 71 篇作者统计合作学者相似作者

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Scalable Advanced DBHi Chiplet Package Using Silicon Bridge with 30 Μm-Pitch Solder Joints
Akihiro Horibe,Takahito Watanabe,Chinami Marushima,Sayuri Kohara,Yasuharu Yamada,Hiroyuki Mori,Divya Taneja, Katherine Pilger, Alexis Jacques-Fortin, Maxime Godard,Qianwen Chen,Eric Perfecto,Aakrati Jain, Joseph R Ross, Thomas Wassick,Isabel De Sousa
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.269-273, (2024)
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Direct Bonded Heterogeneous Integration (dbhi): Surface Bridge Approach for Die Tiling
Claudia Cristina Barrera Pulido,Sayuri Kohara,Aakrati Jain,Thomas Wassick,Divya Taneja, Philip McInnes,Akihiro Horibe,Isabel de Sousa
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1053-1059, (2023)
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Analysis of process dependent mechanical properties of sintered copper nanoparticle pillars for the plating-free bumping by finite element method
Sayuri Kohara,Toyohiro Aoki,Chinami Marushima, Christine Taylor,Kuniaki Sueoka,Takashi Hisada
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-8, (2022)
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Surface Silicon Bridge Direct Bonded Heterogeneous Integration (S-Dbhi)
Kamal Sikka, Isabel De Sousa,Aakrati Jain,Chinami Marushima,Toyohiro Aoki,Sayuri Kohara,Hiroyuki Mori,Takashi Hisada
2022 6th IEEE Electron Devices Technology &amp Manufacturing Conference (EDTM) (2022)
引用1浏览0EIWOS引用
1
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Thermal Analysis of DBHi (Direct Bonded Heterogeneous Integration) Si Bridge
Keiji Matsumoto,Marc Bergendahl,Kamal Sikka,Sayuri Kohara,Hiroyuki Mori,Takashi Hisada
IEEE 71ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2021)pp.1382-1390, (2021)
引用2浏览0EIWOS引用
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作者统计

#Papers: 71

#Citation: 586

H-Index: 16

G-Index: 23

Sociability: 5

Diversity: 1

Activity: 0

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