基本信息
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Career Trajectory
Bio
Dr. Sitaram Arkalgud has served as Director, 3D Interconnect of SEMATECH since 2007. While on assignment to SEMATECH from Qimonda/Infineon Technologies, Arkalgud directed SEMATECH's Interconnect division for three years, during which time he led efforts to screen, characterize, and improve the performance of low-k dielectric materials for the ITRS 45 and 32nm technology generations, and also initiated the exploration of next-generation 3D interconnects.
Prior to his assignment at SEMATECH, Arkalgud served as Infineon's director of the MRAM Development Alliance between Infineon and IBM. Earlier, he worked as a Technology Officer for the Memory Products Division and product manager for Ferroelectric RAM development at Infineon. Arkalgud came to Infineon from Motorola Inc., after working for nine years in several advanced logic and memory projects.
The author of more than 26 publications and presentations, and holder of 14 U.S. patents, Arkalgud earned a doctorate and master's degree in materials engineering from Rensselaer Polytechnic Institute in Troy, NY, and a bachelor's degree in metallurgical engineering from Karnataka Regional Engineering College, Suratkal, India.
Research Interests
Papers共 42 篇Author StatisticsCo-AuthorSimilar Experts
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2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1633-1638, (2024)
Partha Mukhopadhyay,Laura Wenzel,Catharina Rudolph, Andrew Tuchman,Kevin Ryan, Adam Gildea, Chris Nichols, John Allgair,Sitaram Arkalgud,Anton deVilliers,Jim Fulford
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1923-1928, (2024)
Soodoo Chae,Hojin Kim,Nayoung Bae, Stephen Mancini,Lior Huli,Steven Gueci,Dave Hetzer,Sitaram Arkalgud
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.2034-2039, (2023)
Qianwen Chen,Michael Belyansky,Yasir Sulehria,Akihiro Horibe, Liqiao Qin,Ruturaj Pujari,Eric Perfecto,Fee Li Lie,Shahid Butt, Nick Polomoff,Risa Miyazawa,Sayuri Kohara,Mukta Farooq,Takashi Hisada,Jennifer Oakley,Spyridon Skordas,Susan Fan,Katsuyuki Sakuma,John Knickerbocker,Dale Mcherron,Takeshi Tamura,Takayuki Ishii, Panupong Jaipan, Satoshi Nishimura,Ilseok Son,Yohei Maeda,Takashi Koga, Joseph Klein, Kei Tashiro,Sitaram Arkalgud,Yoshihiro Kondo
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1175-1180, (2023)
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.707-711, (2022)
2017 Pan Pacific Microelectronics Symposium (Pan Pacific)pp.1-6, (2017)
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2017 PAN PACIFIC MICROELECTRONICS SYMPOSIUM (PAN PACIFIC) (2017)
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Journal of microelectronics and electronic packagingno. 3 (2015): 123-128
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Author Statistics
#Papers: 42
#Citation: 274
H-Index: 10
G-Index: 16
Sociability: 5
Diversity: 1
Activity: 0
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