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论文共 91 篇作者统计合作学者相似作者

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A Microstructural Investigation of Sub-1 Μm Copper Bonding Contact Structures in Die-to-Wafer Hybrid Bonding
Sari Al Zerey, Junghyun Cho,Roy Yu,Katsuyuki Sakuma
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1306-1311, (2024)
引用0浏览0EIWOS引用
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Voids-free Die-level Cu/ILD Hybrid Bonding
Katsuyuki Sakuma,Roy Yu, Nicholas Polomoff, Luke Darling, Promod Chowdhury,Sathya Raghavan, Keodara Seifert,John Knickerbocker,Dale McHerron,Ming Li,Siu Cheung So, So Ying Kwok,Chun Ho Fan,Siu Wing Lau
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.800-805, (2023)
引用1浏览0EIWOS引用
1
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Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
Prabudhya Roy Chowdhury,Sathya Raghavan, Luke Darling,Aakrati Jain, Promod R. Chowdhury,Mukta Ghate Farooq,Katsuyuki Sakuma
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1418-1425, (2023)
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Heterogeneous Integration on Organic Interposer Substrate with Fine-Pitch RDL and 40 Micron Pitch Micro-bumps
Katsuyuki Sakuma,Griselda Bonilla,Dale McHerron,Toyohiro Aoki, Russell Kastberg,Glenn Pomerantz, Jay Bunt,Tom Wassick
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.872-877, (2023)
引用1浏览0引用
1
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Artificial Intelligence (AI) Based Methodology to Minimize Asymmetric Bare Substrate Warpage
Sathya Raghavan,Hiroyuki Mori,Griselda Bonilla,Katsuyuki Sakuma
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1213-1218, (2023)
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Fabrication and Performance of 300-Mm Wafer-Scale Silicon Microchannel Cooler
Evan G. Colgan,Kai Schleupen, Phillip Mann, Robert P. Kuder,Jae-Woong Nah,Katsuyuki Sakuma, Victor Alvarez,Lavanya Turlapati, Danny C. Wong,Stanislav Lukashov, Steve Cordes,James L. Speidell
IEEE transactions on components, packaging, and manufacturing technologyno. 4 (2023): 472-480
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作者统计

#Papers: 91

#Citation: 2462

H-Index: 23

G-Index: 49

Sociability: 6

Diversity: 2

Activity: 2

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