研究兴趣

论文共 6 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Voids-free Die-level Cu/ILD Hybrid Bonding
Katsuyuki Sakuma,Roy Yu, Nicholas Polomoff, Luke Darling, Promod Chowdhury,Sathya Raghavan, Keodara Seifert,John Knickerbocker,Dale McHerron,Ming Li,Siu Cheung So, So Ying Kwok,Chun Ho Fan,Siu Wing Lau
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.800-805, (2023)
引用1浏览0EIWOS引用
1
0
Modeling of the Temperature Profile and Residual Stress During Thermal Compression Bonding in 3D Packages
Prabudhya Roy Chowdhury,Sathya Raghavan, Luke Darling,Aakrati Jain, Promod R. Chowdhury,Mukta Ghate Farooq,Katsuyuki Sakuma
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1418-1425, (2023)
引用0浏览0EIWOS引用
0
0
Artificial Intelligence (AI) Based Methodology to Minimize Asymmetric Bare Substrate Warpage
Sathya Raghavan,Hiroyuki Mori,Griselda Bonilla,Katsuyuki Sakuma
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1213-1218, (2023)
引用0浏览0EIWOS引用
0
0
A Methodology to Optimize Laser Dicing Parameters to Maximize Dicing Quality Through Machine Learning
Sathya Raghavan,Aakrati Jain,Prabudhya Roy Chowdhury,Katsuyuki Sakuma, Roman Doll, Kees Biesheuvel,Jeroen van Borkulo, Faysal Boughorbel
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.139-146, (2023)
引用0浏览0EIWOS引用
0
0
作者统计

#Papers: 6

#Citation: 3

H-Index: 1

G-Index: 1

Sociability: 3

Diversity: 0

Activity: 0

  • 合作者
  • 学生
  • 导师
暂无相似学者，你可以通过学者研究领域进行搜索筛选
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn