Thermal Characterization of 3-D Stacked Heterogeneous Integration (HI) Package for High-Power Computing Applications

Aakrati Jain,Risa Miyazawa,Sathya Raghavan,Prabudhya Roy Chowdhury,Mukta Ghate Farooq,Arvind Kumar,Katsuyuki Sakuma

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC（2023）

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thermal characterization,Heterogeneous Integration,3-D stacking,high-power computing,cooling
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