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Research Interests

Papers共 46 篇Author StatisticsCo-AuthorSimilar Experts

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CFET-compatible Backside Connection Using Dual-Damascene Integration Scheme Comparing W Versus Mo Metallization
Anne Vandooren,Stefaan Van Huylenbroeck, Tanushree Sarkar,Thomas Chiarella,Anshul Gupta, Michele Stucci,Liesbeth Witters, Jan Willlem Maes,Camila Toledo de Carvalho Cavalcante,Harinarayanan Puliyalil,Farid Sebaai,Koen D'have,Nancy Heylen, Sujan Kumar Sarkar, Andrea Mingardi,Serena Iacovo,Pallavi Puttarame Gowda,Anabela Veloso,Nicolas Jourdan, Michael Givens,Sujith Subramanian,Steven Demuynck,Naoto Horiguchi, Zsolt Tokei,Serge Biesemans,Chiyu Zhu, Harsh Vardhan Bana, Hameeda Jagalur Basheer
Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials (2024)
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Tungsten Carbide Hard Mask Performance in Supervia and High Aspect Ratio Patterning for BEOL Advanced Interconnects
Daniel Montero, Philippe Marien,Yannick Hermans, Fulya Ulu Okudur, Mattia Pasquali,Syamashree Roy,Chen Wu, Nunzio Buccheri,Victor Vega-Gonzalez,Harinarayanan Puliyalil, Quyang Lin, Gilberto Casillas,Jef Geypen,Alfonso Sepulveda,Frederic Lazzarino,Seongho Park, Zsolt Tokei
Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials (2024)
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Improving Uniformity of 3-Level High Aspect Ratio Supervias
D. Montero,P. Marien,Y. Hermans,V. Vega-Gonzalez,Y. Feurprier,N. Oikawa,N. Buccheri,C. Wu,G. T. Martinez,D. Batuk,H. Puliyalil,S. Decoster,K. Kumar,F. Lazzarino,G. Murdoch,S. Park,Z. Tokei
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM (2023)
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Author Statistics

#Papers: 46

#Citation: 694

H-Index: 14

G-Index: 26

Sociability: 6

Diversity: 2

Activity: 1

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