Anshul Gupta

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论文共 48 篇作者统计合作学者相似作者

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First Demonstration of Two Metal Level Semi-damascene Interconnects with Fully Self-aligned Vias at 18MP

Giulio Marti,Ankit Pokhrel,Gayle Murdoch,Gilles Delie,Anshul Gupta, Philippe Marien,Alicja Lesniewska,Stefan Decoster,Souvik Kundu,Quoc Toan Le,Yusuke Oniki,Bart Kenens, Yanick Hermans,Seongho Park,Zsolt Tokei

2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)

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Demonstration of MP18-26nm Ru Semi-Damascene Spacer-is-Dielectric SADP Integration

Chen Wu, Stefan Decoster, Vincent Renaud, Yannick Hermans, Philippe Marien, Giulio Marti, Nancy Heylen,Bart Kenens, Syamashree Roy, Fulya Ulu Okudur, Quoc Toan Le, Naveen Reddy, Alfonso Sepulveda Marquez, Gilles Delie,Anshul Gupta,Alicja Leśniewska,Gayle Murdoch,Seongho Park, Zsolt Tőkei

2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)

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Exploring GAA-Nanosheet, Forksheet and GAA-Forksheet Architectures: a TCAD-DTCO Study at 90 Nm & 120 Nm Cell Height

Gautam Gaddemane,Pieter Schuddinck, Krishna Bhuwalka, Gerhard Rzepa,Gioele Mirabelli,Anshul Gupta, Jürgen Bömmels, Philippe Matagne,Dmitry Yakimets, Hao Wu, Lei Hou,Geert Hellings, Changze Liu

IEEE Journal of the Electron Devices Societyno. 99 (2024): 1-1

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Low-temperature Electronic Transport Properties of Ruthenium Thin Films and Nanowires

Nikolai Mai, Thomas Heinzel, Mihai Cerchez, Shibesh Dutta,Anshul Gupta, Shreya Kundu,Giacomo Talmelli, Florin Ciubotaru, Zsolt Tőkei, Christoph Adelmann

Physical Review Bno. 19 (2024)

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CFET-compatible Backside Connection Using Dual-Damascene Integration Scheme Comparing W Versus Mo Metallization

Anne Vandooren, Stefaan Van Huylenbroeck, Tanushree Sarkar,Thomas Chiarella,Anshul Gupta, Michele Stucci,Liesbeth Witters, Jan Willlem Maes, Camila Toledo de Carvalho Cavalcante, Harinarayanan Puliyalil, Farid Sebaai, Koen D'have,Nancy Heylen, Sujan Kumar Sarkar, Andrea Mingardi, Serena Iacovo, Pallavi Puttarame Gowda,Anabela Veloso,Nicolas Jourdan, Michael Givens,Sujith Subramanian,Steven Demuynck,Naoto Horiguchi, Zsolt Tokei, Serge Biesemans,Chiyu Zhu, Harsh Vardhan Bana, Hameeda Jagalur Basheer

Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials (2024)

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Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking Three Different Fully Self-aligned Via Options

Giulio Marti, Gilles Delie,Gayle Murdoch,Anshul Gupta, Souvik Kundu, Stefan Decoster, Olalla Varela Pedreira,Alicja Lesniewska, Yanick Hermans,Bart Kenens, Fulya Ulu Okudur,Seongho Park, Zsolt Tőkei

2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)

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Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects

Anshul Gupta, Shreya Kundu, Stefan Decoster, K. Sah, G. Delie, B. Truijen,Davide Tierno, Giulio Marti, O. Varela Pedreira, B. Kenens, Y. Hermans, C. Adelmann,B. de Wachter, Ivan Ciofi, G. Murdoch, A. Cross,Seongho Park, Zsolt Tokei

Symposium on VLSI Technologypp.1-2, (2024)

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Two-metal-level Semi-Damascene Interconnect at Metal Pitch 18 Nm and Aspect-Ratio 6 Routed Using Fully Self-Aligned Via