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Research Interests

Papers共 46 篇Author StatisticsCo-AuthorSimilar Experts

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Demonstration of MP18-26nm Ru Semi-Damascene Spacer-is-Dielectric SADP Integration
Chen Wu, Stefan Decoster, Vincent Renaud, Yannick Hermans, Philippe Marien, Giulio Marti, Nancy Heylen,Bart Kenens, Syamashree Roy, Fulya Ulu Okudur, Quoc Toan Le, Naveen Reddy, Alfonso Sepulveda Marquez, Gilles Delie,Anshul Gupta,Alicja Leśniewska,Gayle Murdoch,Seongho Park, Zsolt Tőkei
2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)
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CFET-compatible Backside Connection Using Dual-Damascene Integration Scheme Comparing W Versus Mo Metallization
Anne Vandooren, Stefaan Van Huylenbroeck, Tanushree Sarkar,Thomas Chiarella,Anshul Gupta, Michele Stucci,Liesbeth Witters, Jan Willlem Maes, Camila Toledo de Carvalho Cavalcante, Harinarayanan Puliyalil, Farid Sebaai, Koen D'have,Nancy Heylen, Sujan Kumar Sarkar, Andrea Mingardi, Serena Iacovo, Pallavi Puttarame Gowda,Anabela Veloso,Nicolas Jourdan, Michael Givens,Sujith Subramanian,Steven Demuynck,Naoto Horiguchi, Zsolt Tokei, Serge Biesemans,Chiyu Zhu, Harsh Vardhan Bana, Hameeda Jagalur Basheer
Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials (2024)
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Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking Three Different Fully Self-aligned Via Options
Giulio Marti, Gilles Delie,Gayle Murdoch,Anshul Gupta, Souvik Kundu, Stefan Decoster, Olalla Varela Pedreira,Alicja Lesniewska, Yanick Hermans,Bart Kenens, Fulya Ulu Okudur,Seongho Park, Zsolt Tőkei
2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)
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Mitigating Line-Break Defectivity with a Sandwiched TiN or W Layer for Metal Pitch 18 NM Aspect Ratio 6 Semi-Damascene Interconnects
Anshul Gupta, Shreya Kundu, Stefan Decoster, K. Sah, G. Delie, B. Truijen,Davide Tierno, Giulio Marti, O. Varela Pedreira, B. Kenens, Y. Hermans, C. Adelmann,B. de Wachter, Ivan Ciofi, G. Murdoch, A. Cross,Seongho Park, Zsolt Tokei
Symposium on VLSI Technologypp.1-2, (2024)
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Towards Enabling Two Metal Level Semi-Damascene Interconnects for Superconducting Digital Logic: Fabrication, Characterization and Electrical Measurements of Superconducting NbxTi(1-x)N
Ankit Pokhrel,Anshul Gupta,Min-Soo Kim,Jean-Philippe Soulie, Sujan Kumar Sarkar,Yann Canvel, Vincent Renaud,Bart Kenens,Blake Hodges,Trent Josephsen, Sabine O'Neal,Quentin Herr,Anna Herr,Zsolt Tokei
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM (2023)
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Author Statistics

#Papers: 44

#Citation: 526

H-Index: 13

G-Index: 22

Sociability: 6

Diversity: 0

Activity: 1

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