Zsolt Tokei - Cohesive Program Management, Imec

基本信息

Career Trajectory

Bio

Zsolt Tőkei joined Imec, Leuven, Belgium, in 1999, as a Process Engineer in the field of copper low-k interconnects, the Head of the Metal Section, and then, he became a Principal Scientist and the Program Director of Nano-interconnects, and in 2016, he became a Distinguished Member of Technical Staff, where he was involved in the range of interconnect issues including scaling, metallization, electrical characterization, module integration, reliability, and system aspects.

Education

Experience

Research Interests

Papers共 360 篇Patents共 59 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选

All20242023202220212020201920182017201620152014201320122011201020092008200720062005

Selecting Alternative Metals for Advanced Interconnects

Jean-Philippe Soulie,Kiroubanand Sankaran,Benoit Van Troeye,Alicja Lesniewska,Olalla Varela Pedreira,Herman Oprins,Gilles Delie,Claudia Fleischmann, Lizzie Boakes, Cedric Rolin,Lars-Ake Ragnarsson,Kristof Croes,Seongho Park,Johan Swerts,Geoffrey Pourtois,Zsolt Tokei,Christoph Adelmann

JOURNAL OF APPLIED PHYSICSno. 17 (2024)

Cited0Views22Bibtex

Directional Etching of Barrierless NiAl Lines on 300-Mm Wafers for Interconnects Applications

Souvik Kundu,J. -P. Soulie,G. Marti, F. U. Okudur,Shreya Kundu,L. Souriau,F. Lazzarino,G. Murdoch, S. Park,Z. Tokei

IEEE ELECTRON DEVICE LETTERSno. 10 (2024): 2033-2035

Cited0Views1Bibtex

Self-aligned 8nm T2T As Cell Boundary in the Middle-of-line

P. Marien,Y. Hermans,S. Choudhury,S. Kundu,S. Decoster, F.U. Okudur, N. Reddy, B. Kenens,N. Jourdan, G. Delie,G. Marti,C. Wu, V. V. Gonzalez,G. Murdoch,S. Park,Z. Tőkei

2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)

Cited0Views0EIWOSBibtex

Demonstration of MP18-26nm Ru Semi-Damascene Spacer-is-Dielectric SADP Integration

Chen Wu,Stefan Decoster, Vincent Renaud,Yannick Hermans, Philippe Marien,Giulio Marti,Nancy Heylen,Bart Kenens,Syamashree Roy, Fulya Ulu Okudur,Quoc Toan Le, Naveen Reddy, Alfonso Sepulveda Marquez,Gilles Delie,Anshul Gupta,Alicja Leśniewska,Gayle Murdoch,Seongho Park,Zsolt Tőkei

2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)

Cited0Views0EIWOSBibtex

Experimental Thermal Characterization of Thin Film Low-K Dielectric Materials

Herman Oprins,Vladimir Cherman,Bjorn Vermeersch, Federica Luciano,Xinyue Chang,Valeria Founta, Youqi Ding,Christoph Adelmann,Zsolt Tokei

2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)pp.1-8, (2024)

Cited0Views1EIWOSBibtex

Low-temperature Electronic Transport Properties of Ruthenium Thin Films and Nanowires

Nikolai Mai,Thomas Heinzel, Mihai Cerchez,Shibesh Dutta,Anshul Gupta,Shreya Kundu,Giacomo Talmelli,Florin Ciubotaru,Zsolt Tokei,Christoph Adelmann

PHYSICAL REVIEW Bno. 19 (2024)

Cited0Views1Bibtex

Enabling 0.33NA EUV Lithography Patterning Towards MP16 SADP Semi-Damascene Metallization, Setting the Benchmark for High-NA EUV

Yannick Hermans,Stefan Decoster,Chen Wu, Jan Doise, Vincent Renaud,Dieter Van Den Heuvel,Seongho Park, Paulina A. Rincon-Delgadillo,Zsolt Tokei

International Conference on Extreme Ultraviolet Lithography 2024 (2024)

Cited0Views0Bibtex

Redefining 2-Level Semi-Damascene Interconnect Technology: Benchmarking Three Different Fully Self-aligned Via Options

Giulio Marti,Gilles Delie,Gayle Murdoch,Anshul Gupta,Souvik Kundu,Stefan Decoster,Olalla Varela Pedreira,Alicja Lesniewska, Yanick Hermans,Bart Kenens, Fulya Ulu Okudur,Seongho Park,Zsolt Tőkei

2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)

Cited0Views1EIWOSBibtex

CFET-compatible Backside Connection Using Dual-Damascene Integration Scheme Comparing W Versus Mo Metallization

Anne Vandooren,Stefaan Van Huylenbroeck， Harsh Vardhan Bana, Hameeda Jagalur Basheer

Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials (2024)

Cited0Views2Bibtex

Directional Etching of Barrierless NiAl Lines on 300mm Wafers for Interconnects Applications

S. Kundu,J.-P. Soulié,G. Marti, F. U. Okudur,L. Souriau,F. Lazzarino,G. Murdoch,S. Park,Z. Tőkei

IEEE Electron Device Lettersno. 99 (2024): 1-1

Cited0Views4EIWOSBibtex

Author Statistics

Co-Author

Co-Institution

D-Core

合作者
学生
导师

Kristof Croes合作论文数

Imec67

Gerald P. Beyer合作论文数

K.I.J. (Karen) Maex合作论文数

University of Amsterdam44

c adelmann合作论文数

IMEC, B-3001 Louvain, Belgium40

Christopher J. Wilson合作论文数

Ivan Ciofi合作论文数

Nancy Heylen合作论文数

Mikhail Baklanov合作论文数

North China University of Technology27

Olalla Varela Pedreira合作论文数

Ingrid De Wolf合作论文数

Faculty of Engineering Science, KU Leuven26

Steven Demuynck合作论文数

Anshul Gupta合作论文数

imec24

Francesca Lacopi合作论文数

School of Electrical and Data Engineering, University of Technology Sydney23

Jürgen Bömmels合作论文数

Juergen Boemmels合作论文数

Michele Stucchi合作论文数

Herbert Struyf合作论文数

J. Swerts合作论文数

ASM Belgium21

Seongho Park合作论文数

Stefan Decoster合作论文数

Sven Van Elshocht合作论文数

IMEC20

Inge Asselberghs合作论文数

Imec19

Cedric Huyghebaert合作论文数

IMEC19

Jean-Philippe Soulie合作论文数

Laboratoire de Thermodynamique Appliquée, Institut National des Sciences Appliquées de Lyon19

Julien Ryckaert合作论文数

IMEC19

Francky Catthoor合作论文数

Assiocated Division ESAT-INSYS, Integrated Systems, Department of Electrical Engineering, Catholic University of Leuven;IMEC18

Quoc Toan Le合作论文数

Frederic Lazzarino合作论文数

IMEC17

Gayle Murdoch合作论文数

Guido Groeseneken合作论文数

Faculty of Engineering Science, Catholic University of Leuven;R&D Laboratory, Interuniversity Microelectronics Center17

Marleen Van Hove合作论文数

Youssef Travaly合作论文数

Xiangyu Wu (吴香玉)合作论文数

Larry Zhao合作论文数

Applied Materials16

Bart Soree合作论文数

Physics Department, Universiteit Antwerpen16

L. Carbonell合作论文数

G. Pourtois合作论文数

IMEC16

Stefan De Gendt合作论文数

Praveen Raghavan合作论文数

Apple15

Lesniewska, A.合作论文数

Yunlong Li合作论文数

Marleen H. Van Der Veen合作论文数

Kris Vanstreels合作论文数

IMEC14

Lieve G. Teugels合作论文数

imec14

N. Jourdan合作论文数

N. Horiguchi合作论文数

Antonino Contino合作论文数

imec13

Dutta Shibesh合作论文数

Department of ECE, Amrita Vishwa Vidyapeetham13

Nicolas Jourdan合作论文数

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