基本信息
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个人简介
Steven Demuynck received the Ph.D. degree in physics from Katholieke Universiteit Leuven, Leuven, Belgium, in 2000.
After joining imec in 2001, he has been involved in various interconnect or BEOL integration projects. Gradually focus shifted more toward engineering the middle of line or contacts to source/drain and gate. In 2015, he became the Team Leader of the FEOL Integration Team.
研究兴趣
论文共 160 篇作者统计合作学者相似作者
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Hans Mertens,M. Hosseini,Thomas Chiarella,D. Zhou,S. Wang,G. Mannaert,E. Dupuy,D. Radisic,Z. Tao,Y. Oniki,Andriy Hikavyy, R. Rosseel, A. Mingardi,S. Choudhury, P. Puttarame Gowda,F. Sebaai,A. Peter,Kevin Vandersmissen, J. P. Soulie,An De Keersgieter,L. Petersen Barbosa Lima, C. Cavalcante,D. Batuk,G. T. Martinez,J. Geypen, F. Seidel, K. Paulussen,P. Favia,Jürgen Bömmels,Roger Loo, P. Wong, A. Sepulveda Marquez,B. T. Chan,Jérôme Mitard, S. Subramanian,S. Demuynck,E. Dentoni Litta,N. Horiguchi,S. Samavedam,S. Biesemans
VLSI Technology and Circuitspp.1-2, (2023)
2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)
Advanced Etch Technology and Process Integration for Nanopatterning XI (2022)
A. Gupta,Z. Tao,D. Radisic,H. Mertens,O. Varela Pedreira,S. Demuynck,J. Boemmels,K. Devriendt,N. Heylen,S. Wang,K. Kenis,L. Teugels,F. Sebaai,C. Lorant,N. Jourdan,B. T. Chan,S. Subramanian,F. Schleicher,A. Peter,N. Rassoul, Y. Siew,B. Briggs,D. Zhou,E. Rosseel,E. Capogreco,G. Mannaert,A. Sepulveda,E. Dupuy,K. Vandersmissen,B. Chehab,G. Murdoch,E. Altamirano Sanchez,S. Biesemans,Zs Tokei,E. Dentoni Litta,N. Horiguchi
A. Veloso,A. Jourdain,D. Radisic,R. Chen,G. Arutchelvan,B. O'Sullivan,H. Arimura,M. Stucchi,A. De Keersgieter,M. Hosseini,T. Hopf, K. D'have,S. Wang,E. Dupuy,G. Mannaert,K. Vandersmissen,S. Iacovo,P. Marien,S. Choudhury,F. Schleicher,F. Sebaai,Y. Oniki, X. Zhou,A. Gupta,T. Schram,B. Briggs,C. Lorant,E. Rosseel,A. Hikavyy,R. Loo,J. Geypen,D. Batuk,G. T. Martinez,J. P. Soulie,K. Devriendt,B. T. Chan,S. Demuynck,G. Hiblot,G. Van der Plas,J. Ryckaert,G. Beyer,E. Dentoni Litta,E. Beyne,N. Horiguchi
IEEE transactions on electron devices/IEEE transactions on electron devicesno. 12 (2022): 7173-7179
International Interconnect Technology Conferencepp.1-3, (2021)
Antony Premkumar Peter,Takayama Tomomi,Ebisudani Taishi, Shiba Eiichiro,Alfonso Sepulveda,Timothee Blanquart,Yosuke Kimura,Sujith Subramanian,Sylvain Baudot,Briggs Basoene,Anshul Gupta,Anabela Veloso,Elena Capogreco,Hans Mertens,Johan Meersschaut,Thierry Conard,Praveen Dara,Jef Geypen,Gerardo Martinez,Dmitry Batuk,Steven Demuynck,Pierre Morin
A. Veloso, A. Jourdain, G. Hiblot,F. Schleicher, K. D’have, F. Sebaai,D. Radisic,R. Loo, T. Hopf, A. De Keersgieter,H. Arimura, G. Eneman,P. Favia, J. Geypen,G. Arutchelvan,A. Chasin,D. Jang,L. Nyns,E. Rosseel,A. Hikavyy,G. Mannaert, B. T. Chan,K. Devriendt,S. Demuynck,G. Van der Plas,J. Ryckaert,G. Beyer,E. Dentoni Litta,E. Beyne,N. Horiguchi
Symposium on VLSI Technologypp.1-2, (2021)
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Narendra Parihar,Goutham Arutchelvan,Jacopo Franco,Sylvain Baudot, Ann Opedebeeck,Steven Demuynck,Hiroaki Arimura, Lars-Ake Ragnarsson,Jerome Mitard,Vincent De Heyn,Abdelkarim Mercha
2021 IEEE INTERNATIONAL INTEGRATED RELIABILITY WORKSHOP (IIRW)pp.29-32, (2021)
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作者统计
#Papers: 159
#Citation: 1917
H-Index: 24
G-Index: 36
Sociability: 7
Diversity: 3
Activity: 4
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