Richard Langlois

Richard Langlois received the B.Eng. degree in engineering physics and the M.Sc. and Ph.D. degrees in materials science from the Ecole polytechnique de Montreal, QC, Canada. He then joined the National Research Council of Canada, where he worked on various projects such as high-tech ceramics and ceramic matrix composites, ultrafine powder synthesis, fracture mechanics applied to ceramics, metal strip casting, and metal matrix composites. In 1991, he joined IBM Canada, Bromont, QC, Canada, where he has been involved in the development of a large number of technologies and packaging processes, including electroless and electrolytic plating processes, high T metal diffusion, brazing and soldering, sputtering, thermal management, transition to lead-free solders, temporary chip attach, thermocompression bonding (2.1, 2.5, and 3-D), chip rework on ceramic and organic carriers, and more recently on silicon photonics packaging.