Low Temperature Formation of SAC-SnBi BGA Interconnections Using Solid Liquid Inter-Diffusion (SLID)

Divya Taneja,David Danavitch,Malak Kanso,Richard Langlois,Nicolas Boyer, Eric Dalpe

IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)（2022）

引用 1|浏览8
暂无评分
关键词
Ball grid array (BGA),interconnection,low temperature solder,Tin-Bismuth (Sn-Bi),Solid Liquid Interdiffusion (SLID)
AI 理解论文
溯源树
样例
生成溯源树，研究论文发展脉络
Chat Paper
正在生成论文摘要