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Artificial Intelligence, Heterogeneous Integration
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Papers共 39 篇Author StatisticsCo-AuthorSimilar Experts
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2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1004-1011, (2023)
Mukta Farooq, Arvind Kumar, Sae-Kyu Lee,Ravi Bonam,Juan-Manuel Gomez,James Kelly,Kohji Hosokawa,Akiyo Nomura,Yasuteru Kohda,Timothy Dickson,Katsuyuki Sakuma,Hiroyuki Mori, Joshua Rubin,Iqbal Saraf,Vinay Pai,Pablo Nieves, Yandong Li, Abraham DelaPena,Thomas Wassick,Eric Perfecto, Christopher Carr, Viraj Sardesai,Eric Miller,Jennifer Oakley,Spyridon Skordas,Sean Teehan,Dale McHerron, Jeff Burns,Rama Divakaruni
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
Kamal Sikka,Ravi Bonam,Yang Liu,Paul Andry,Dishit Parekh,Aakrati Jain,Marc Bergendahl,Rama Divakaruni,Maryse Cournoyer,Pascale Gagnon,Catherine Dufort, Isabel de Sousa,Hongqing Zhang, Ed Cropp, Thomas Wassick,Hiroyuki Mori,Sayuri Kohara
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.136-147, (2021)
2021 20th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.52-58, (2021)
Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systemspp.69-76, (2020)
Extreme Ultraviolet (EUV) Lithography X (2019)
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Author Statistics
#Papers: 39
#Citation: 421
H-Index: 10
G-Index: 19
Sociability: 5
Diversity: 2
Activity: 0
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