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    • International Conference on Electronics Packaging (ICEP)Conference

    Papers
    Flip Chip Joining with Low Temperature Solders and Thermal Gradient Bonding
    Toyohiro Aoki,Eiji Nakamura,Takashi Hisada,Hiroyuki Mori,Shintaro Yamamichi
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2017）
    In this study, we investigated effects of thermal gradient of joint during flip chip bonding on intermetallic compound (IMC) growth for several solder materials. Cu/Sn2.5Ag/Cu joint was prepared by bonding electroplated Cu/Sn2.5Ag bump on Cu pad. Ni/Sn/Ni, Ni/In/Ni, Ni/In-48Sn/Ni...
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    Broadband Antenna with Asymmetrical Radiating Elements for Cognitive Radio System
    Tomohiro Yamada,Shota Zempo,Fukuro Koshiji,Kohji Koshiji
    2016 International Conference on Electronics Packaging (ICEP)（2016）
    In recent years, cognitive radio system has been receiving particular attention as a promising technology in order to materialize efficient network access. In this paper, heightening upper limit frequency of the wideband antenna for cognitive radio system was investigated by empl...
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    Impact of Backside Process on High Aspect Ratio Via-Middle Cu Through Silicon Via Reliability
    Yunlong Li,Stefaan Van Huylenbroeck,Joeri De Vos,Michele Stucchi,Kristof Croes,Gerald P. Beyer,Eric Beyne
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2017）
    For 3D chip stacking using via-middle Cu Through Silicon Via (TSV), the TSV liner/barrier reliability needs to be preserved during the whole backside process flow. In this paper, the impact of backside process on the via-middle TSV liner/barrier material reliability is investigat...
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    Behavior Analysis Method for Product Design Support a Study on Modeling of Behavior and Functions
    Eiji Morinaga,Hidefumi Wakamatsu,Eiji Arai,Hijiri Abiru
    2014 International Conference on Electronics Packaging (ICEP)（2014）
    Recent industrial globalization has increased the number of unanticipated product failures and troubles caused by using them in unexpected ways or situations. Developing new type of products to meet recent requirements for product innovation may also cause unanticipated troubles ...
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    Additive Manufacturing of Magnetic Components for Power Electronics Integration
    Yi Yan,Khai D. T. Ngo,Yuhui Mei,Guo-Quan Lu
    International Conference on Electronics Packaging（2016）
    In an effort to simplify power electronics integration, we explored an additive manufacturing (AM) process, or commonly known as three-dimensional (3D) printing for fabricating magnetic components. A commercial fused-deposition-model (FDM) 3D printer was modified to extrude paste...
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    Simple Modeling Method of EMI Simulation for PCB
    Mitsuharu Umekawa
    International Conference on Electronics Packaging（2017）
    This paper proposes simple simulation modeling method of Electromagnetic Interference (EMI) and predicting potential risk of EMI radiation by specific noise source focused on Printed Circuit Board (PCB). Electromagnetic Simulation (EM) is commonly used to accurately determine the...
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    Interconnect Fabrication Using Copper Oxide Particles by Photonic-sintering
    Po-Hsiang Chiu,Jenn-Ming Song
    International Conference on Electronics Packaging（2019）
    Hybrid pastes containing copper oxide particles with nano-(NPO) and submicron sizes (SMPO) were successfully developed for conductor fabrication through photonic sintering. Subjected to 3 or 4 flash pulses, copper particle pastes can be transformed into conductive sintered struct...
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    Fem Simulation Of Warpage Orientation Change Of Frp Polymer Substrate During Thermal Processing
    Cheolgyu Kim,Tae-Ik Lee,Min Sung Kim,Taek-Soo Kim
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2017）
    Warpage of semiconductor packaging substrate during or after manufacturing processes has been a serious issue in the electronics industry. We found that the packaging substrate, which has initial warpage at room temperature, changes its warpage orientation by flipping from a conc...
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    Effect of Reflow Conditions on the Intermetallic Layer in Solder Joints
    K. Nogita,F. Somidin,M. A. A. Mohd Salleh,K. Sweatman,T. Nishimura,S. D. McDonald,H. Maeno,S. Matsumura
    International Conference on Electronic Packaging and iMAPS All Asia Conference（2018）
    The Cu 6 Sn 5 intermetallic formed between Pb-free Sn-based solders and Cu substrates plays a critical role in the reliability of solder joints. Cu 6 Sn 5 can adopt at least two different crystal structures over the temperature range to which electronics circuitry is exposed duri...
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    Direct Bonding with Ni-P Finished DBC Substrate with Sinter Ag Micro-Sized Particles
    Chuantong Chen,Zheng Zhang, Takuya Misaki,Shijo Nagao,Katsuaki Suganuma
    International Conference on Electronics Packaging（2019）
    Sinter Ag joining as an attractive die attach material received more and more attention. Usually, to obtained an excellent strength bonding, sinter Ag joining need contact with the Ag, Au metallization layer on both chips and substrates. The electro- and electroless-plated Ni(P) ...
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    Thermal Stresses Around Void in Through Silicon Via in 3d Sip
    Takahiro Kinoshita,Tomoya Sugiura,Takashi Kawakami, Keiji Matsumoto,Sayuri Kohara,Yasumitsu Orii
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2014）
    Thermal stresses around void in TSV (Through Silicon Via) structure in 3D SiP were discussed under the conditions of device operation and reflow process by using FEM (Finite Element Method). In case of the condition of device operation, equivalent stress around void inside Cu TSV...
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    Phase Transformations of Alloyed and Core-Shell Metallic Nanoparticles for Interconnect Applications
    Jenn-Ming Song
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2014）
    In this study, the phase evolution upon heating of thiol-protected NPs of gold, silver and their alloys with various Au/Ag ratios (3:1, 1:1, and 1:3), as well as the phase transitions and oxidation of copper and copper-silver core shell NPs, are monitored by synchrotron radiation...
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    Print and Imprint Method for Nanoimprint Lithography with High-Viscosity Photo-Curable Resins
    T. Nakamura,M. Nakagawa
    International Conference on Electronics Packaging（2017）
    Ultraviolet nanoimprint lithography (UV-NIL) has become one of advanced pattering methods for fabrication of micro-and nano-structures over several inches by replication with designed mold patterns at high throughput and low cost. For practical application of UV-NIL, it is essent...
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    A MEMS-based Measurement Approach for Contact Normal Force Measurement in Crimp Terminals
    S. Majcherek,A. Aman, J. Fochtmann
    2017 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2017）
    With the increasing number of plug connections in products, which are proportionally less and less space consuming, the potential for device failure caused by defect connectors increases. Therefore, it will be increasingly important to ensure the proper functioning of the electri...
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    High Speed Panel Level Metallization Technology
    Herbert Oetzlinger,Claudia Landstorfer,Tetsuya Onishi,Christian Dunkel,Raoul Schroeder
    International Conference on Electronics Packaging（2019）
    New microelectronics applications such as smartphones, automotive computing and server/AI CPUs heavily rely on wafer-level packaging (WLP) to meet performance targets. To meet future cost targets as well, Outsourced Semiconductor Assembly and Test (OSAT) foundries look to panel l...
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    Materials Informatics Technique for Designing Strong-Adhesion Interfaces in Electronics Devices
    Tomio Iwasaki
    2019 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2019)（2019）
    A materials-informatics technique for designing strong flat interfaces has been developed by use of advanced simulation that can calculate the delamination energy as the adhesion strength. In this study, this technique is applied to the design of metal (or alloy) with strong adhe...
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    Electromagnetic Field Analysis of Human Body Communication Between Wearable and Stationary Devices Including the Earth Ground
    Misaki Kurosu,Fukuro Koshiji,Kohji Koshiji
    2014 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP)（2014）
    In this study, we investigated the electric field distribution and transmission characteristics between a stationary device and an arm-mounted wearable human body communication device including earth ground. The results showed that when the stationary device signal electrode is e...
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    Introduction of Sub-2-micron Cu Traces to EnCoRe Enhanced Copper Redistribution Layers for Heterogeneous Chip Integration
    Hiroshi Kudo, Yuuki Aritsuka,Tanaka Masaya,Ryohei Kasai,Jyunichi Suyama,Mitsuhiro Takeda,Yumi Okazaki,Haruo Iida,Daisuke Kitayama,Kouji Sakamoto,Takamasa Takano,Miyuki Akazawa,
    2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC)（2018）
    The fabrication of a 2.5D glass interposer was demonstrated, and its electrical performance, including signal transmission, was characterized. Single-sided multi-level enhanced copper redistribution layers were fabricated on a glass substrate with through glass via. This structur...
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    Solder Electromigration Failure Time As a Function of the Angle Between the C-Axis of Sn Crystals and Direction of Electron Flow
    T. Sakai, E. Watanabe, T. Sei, K. Yamanaka
    2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC)（2018）
    Electromigration (EM) in Sn-based solder joints is recognized as a major reliability problem in high performance semiconductor devices in the current microelectronics area and in power modules in the next generation hybrid and electric vehicles. It is known that the EM failure ti...
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    Cu-Sn Based Die Attach Material for Power Semiconductor with Stress Control
    Hiroaki Ikeda,Shigenobu Sekine,Ryuji Kimura,Koichi Shimokawa,Keiji Okada,Hiroaki Shindo,Tatsuya Ooi,Rei Tamaki
    2018 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING AND IMAPS ALL ASIA CONFERENCE (ICEP-IAAC)（2018）
    This paper describes development of joint materials using only base metals (Cu and Sn) for power semiconductor assembly. The preform sheet of the joint material is made by two kinds of particles such as Cu source and Cu-Sn IMC source. Optimized ratio of Cu source: IMC source prov...
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