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论文共 13 篇作者统计合作学者相似作者

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Non-poisoning dual Damascene patterning scheme for low-k and ultra low-k BEOL
W. Cote,D. Edelstein, C. Bunke, P. Biolsi,W. Wille, H. Baks, R. Conti,T. Dalton, T. Houghton,W-K. Li,Y-H. Lin, S. Moskowitz,D. Restaino,T. Van Kleeck,S. Vogt,T. Ivers
ADVANCED METALLIZATION CONFERENCE 2006 (AMC 2006)pp.289-294, (2007)
引用0浏览0引用
0
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A SiCOHBEOL interconnect technology for high density and high performance 65 nm CMOS applications
M Angyal,J Gill,M Inohara, MF Ng,SH Rhee,S Lane, H Hichri,C Penny,I Melville,V Ramachandran,BC Zhang,YK Siew,F Zhang,KC Park, KW Lee,E Kaltalioglu,SO Kim,G Matusiewicz,YH Lin, K Urata,K Kumar, J Linville,M Minami, H Maynard,M Hoinkis,T Bolom, F Feustel, KS Lam,K Inoue,A Simon, J Smith, B Baker-O'Neal,L Economikos, P Ong, Y Ishikawa, M Naujok,A Sakamoto, T Ema, G Lembach, M Kelling, T Bailey, S Marrokey,WK Li,C Christiansen,BZ Li,T Lee, F Chen, K Chanda,R Filippi, PV McLaughlin,J Demarest,D Dunn,P Flaitz,B Rhoads, C Manya, A Calabrese,P Roper, K Petrarca,W Cote,D McHerron,A Cowley,T Ivers
Advanced Metallization Conference 2005 (AMC 2005)pp.39-46, (2006)
引用0浏览0引用
0
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Copper Interconnect Technology In Semiconductor Manufacturing
Dc Edelstein,Pc Andricacos,B Agarwala, C Carnell,D Chung,E Cooney,W Cote,P Locke,S Luce, C Megivern,R Wachnik, E Walton
ELECTROCHEMICAL PROCESSING IN ULSI FABRICATION AND SEMICONDUCTOR/METAL DEPOSITION II, PROCEEDINGSno. 9 (1999)
引用0浏览0引用
0
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Copper Dual Damascene Wiring For Sub-0.25 Mu M Cmos Technology
J Heidenreich,D Edelstein,R Goldblatt,W Cote,C Uzoh,N Lustig,T Mcdevitt,A Stamper,A Simon,J Dukovic,P Andricacos,R Wachnik,H Rathore, T Katsetos,P Mclaughlin,S Luce,J Slattery
PROCEEDINGS OF THE IEEE 1998 INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCEpp.151-153, (1998)
引用14浏览0引用
14
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An evaluation of Cu wiring in a production 64 Mb DRAM
Cote, W.,Costrini, G.,Edelstein, D., Osborn, C.
Honolulu, HI, USApp.24-25, (1998)
引用2浏览0EIWOS引用
2
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作者统计

#Papers: 13

#Citation: 799

H-Index: 7

G-Index: 8

Sociability: 5

Diversity: 1

Activity: 0

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