Stephane D. Nicolas - Université Paris-Sud, Université Paris-Saclay

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论文共 60 篇作者统计合作学者相似作者

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3-Layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator with High Density TSV for Advanced CMOS Image Sensor Applications

Stéphane Nicolas, Jerzy-Javier Suarez-Berru,Nicolas Bresson,Carole Socquet-Clerc,Myriam Assous,Stéphan Borel,Rémi Vélard,Jérôme Dechamp,Renan Bouis, Antonio Roman,Karine Abadie, Damien Hebras

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.305-311, (2024)

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High-dimensional Multi-Omics Measured in Controlled Conditions Are Useful for Maize Platform and Field Trait Predictions

Baber Ali, Bertrand Huguenin-Bizot, Maxime Laurent,François Chaumont,Laurie C. Maistriaux,Stéphane Nicolas,Hervé Duborjal,Claude Welcker,François Tardieu,Tristan Mary-Huard,Laurence Moreau,Alain Charcosset,Daniel Runcie,Renaud Rincent

THEORETICAL AND APPLIED GENETICSno. 7 (2024)

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Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors

Stéphan Borel,Myriam Assous,Rémi Vélard, Jerzy-Javier Suarez-Berru,Stéphane Nicolas,Jérôme Dechamp,Renan Bouis,Lionel Vignoud, Paul Valentin, Jérémy Marchand, Antonio Roman,Messaoud Bedjaoui

2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.771-777, (2024)

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Genetic Variability of Aquaporin Expression in Maize: from Eqtls to a MITE Insertion Regulating PIP2; 5 Expression

Laurie C. Maistriaux, Maxime J. Laurent,Linda Jeanguenin,Santiago Alvarez Prado,Joseph Nader,Claude Welcker,Alain Charcosset,Francois Tardieu,Stephane D. Nicolas,Francois Chaumont

PLANT PHYSIOLOGYno. 1 (2024): 368-384

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Genome-wide association studies on DNA pools identifies promising maize landraces and genomic regions to develop next generation varieties

Stéphane Nicolas, Antoine E. Roux, Sarah Ben-Sadoun,Marcella Arca, Agustin O. Galaretto,Tristan Mary‐Huard, Paule Tères,Anne Zanetto,Marie‐Christine Le Paslier,Cyril Bauland,Valérie Combes,Delphine Madur,Brigitte Gouesnard,Alain Charcosset

HAL (Le Centre pour la Communication Scientifique Directe) (2023)

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Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications

Jerzy Javier Suarez Berru,Stephane Nicolas,Nicolas Bresson,Myriam Assous,Stephan Borel

2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.97-102, (2023)

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metaGE: Investigating Genotype × Environment interactions through meta-analysis

Annaïg De Walsche,Alexis Vergne,Renaud Rincent,Fabrice Roux,Stephane Nicolas,Claude Welcker,Sofiane Mezmouk,Alain Charcosset,Tristan Mary-Huard

biorxiv（2023）

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Genotyping of DNA pools identifies untapped landraces and genomic regions to develop next-generation varieties

Mariangela Arca,Brigitte Gouesnard,Tristan Mary-Huard,Marie-Christine Le Paslier,Cyril Bauland,Valerie Combes,Delphine Madur,Alain Charcosset,Stephane D. Nicolas

Plant biotechnology journalno. 6 (2023): 1123-1139

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Genomic prediction and landscape genomics in a large maize landraces collection using high-throughput pool genotyping identifies promising sources of diversity for prebreeding

Agustin O. Galaretto,Brigitte Gouesnard,Delphine Madur, Sarah Ben-Sadoun,Sarah Hearne,Valérie Combes, C. Balconi,Ana Butrón,Pedro Revilla,R. A. Malvar,Anne Zanetto,Ana Maria Barata,Danela Murariu,Natalija Kravić,Beate Schierscher-Viret,Pedro Mendes‐Moreira, Amanda Pereira,Hrvoje Šarčević, Monica A. Menz,Stéphane Melkior, Benoit Pétiard,Thomas Presterl,Bettina Kessel, A. Strigens, Amélie Le Foll, Carole Derue,Alain Murigneux, U. Lohwasser,Cyril Bauland, Sandra Goritschnig,Violeta Andjelković,Alain Charcosset,Stéphane Nicolas

HAL (Le Centre pour la Communication Scientifique Directe) (2023)

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