Chrome Extension
WeChat Mini Program
Use on ChatGLM
VIPCreated with Sketch.
Research Interests

Papers共 19 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
3-Layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator with High Density TSV for Advanced CMOS Image Sensor Applications
Stéphane Nicolas, Jerzy-Javier Suarez-Berru,Nicolas Bresson,Carole Socquet-Clerc,Myriam Assous,Stéphan Borel,Rémi Vélard,Jérôme Dechamp,Renan Bouis, Antonio Roman,Karine Abadie, Damien Hebras
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.305-311, (2024)
Cited0Views0EIWOSBibtex
0
0
TXRF Capability of Metallic Contamination Analysis on Rough Silicon Wafers
Viviane Yim, Anna Mukhtarov, Nathalie Drogue, Delphine Autillo, Thierry Lardin,Marc Zussy,Jérôme Dechamp,Delphine Truffier-Boutry
Journal of Materials Researchpp.1-9, (2024)
Cited0Views0Bibtex
0
0
Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors
Stéphan Borel,Myriam Assous,Rémi Vélard, Jerzy-Javier Suarez-Berru,Stéphane Nicolas,Jérôme Dechamp,Renan Bouis,Lionel Vignoud, Paul Valentin, Jérémy Marchand, Antonio Roman,Messaoud Bedjaoui
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.771-777, (2024)
Cited0Views0EIWOSBibtex
0
0
Backside Thinning Process Development for High-Density TSV in a 3-Layer Integration
Renan Bouis, Jérémy Marchand, Agathe André,Stéphan Borel,Jérôme Dechamp,Lionel Vignoud, Paul Valentin,Myriam Assous, Damien Hebras
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.370-377, (2024)
Cited0Views0EIWOSBibtex
0
0
Haptic Interface Based on an Innovative "Piezo-in-Flex" Piezoelectric Patch Technology
Fabrice Casset, Munique Kazar Mendes,Nadine David,Rémi Franiatte,Daniel Mermin,Marc Zussy,Jérôme Dechamp,Laetitia Castagné,Jean-Charles Souriau, Kevin Benedetto,Mikael Colin
2023 22nd International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers)pp.887-890, (2023)
Cited0Views0EIWOSBibtex
0
0
Scalable Through Molding Interconnection realization for advanced Fan Out Wafer Level Packaging applications
Aurelia Plihon,Edouard Deschaseaux,Remi Franiatte,Jerome Dechamp, Simon Vaudaine,Jennifer Guillaume, Catherine Brunet-Manquat,Stephane Moreau,Perceval Coudrain
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2122-2127, (2022)
Cited0Views0EIWOSBibtex
0
0
Lamination of Dry Film Epoxy Molding Compounds for 3D Packaging: Advances and Challenges
Maxime Argoud,Raphael Eleouet,Jerome Dechamp,Nacima Allouti,Laurent Pain,Raluca Tiron, Daisuke Mori, Masahiro Asahara,Yosuke Oi,Katsushi Kan
2021 IEEE 71st Electronic Components and Technology Conference (ECTC) (2021)
Cited0Views0EIWOSBibtex
0
0
Load More
Author Statistics

#Papers: 19

#Citation: 104

H-Index: 4

G-Index: 6

Sociability: 5

Diversity: 1

Activity: 9

  • 合作者
  • 学生
  • 导师
No result temporarily, you can search similar Scholar with the same research interest
Data Disclaimer
The page data are from open Internet sources, cooperative publishers and automatic analysis results through AI technology. We do not make any commitments and guarantees for the validity, accuracy, correctness, reliability, completeness and timeliness of the page data. If you have any questions, please contact us by email: report@aminer.cn