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论文共 51 篇作者统计合作学者相似作者

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3-Layer Fine Pitch Cu-Cu Hybrid Bonding Demonstrator with High Density TSV for Advanced CMOS Image Sensor Applications
Stéphane Nicolas, Jerzy-Javier Suarez-Berru,Nicolas Bresson,Carole Socquet-Clerc,Myriam Assous,Stéphan Borel,Rémi Vélard,Jérôme Dechamp,Renan Bouis, Antonio Roman,Karine Abadie, Damien Hebras
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.305-311, (2024)
引用0浏览0EIWOS引用
0
0
Low Resistance and High Isolation HD TSV for 3-Layer CMOS Image Sensors
Stéphan Borel,Myriam Assous,Rémi Vélard, Jerzy-Javier Suarez-Berru,Stéphane Nicolas,Jérôme Dechamp,Renan Bouis,Lionel Vignoud, Paul Valentin, Jérémy Marchand, Antonio Roman,Messaoud Bedjaoui
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.771-777, (2024)
引用0浏览0EIWOS引用
0
0
Backside Thinning Process Development for High-Density TSV in a 3-Layer Integration
Renan Bouis, Jérémy Marchand, Agathe André,Stéphan Borel,Jérôme Dechamp,Lionel Vignoud, Paul Valentin,Myriam Assous, Damien Hebras
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.370-377, (2024)
引用0浏览0EIWOS引用
0
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Recent Progress in the Development of High-Density TSV for 3-Layers CMOS Image Sensors
Stephan Borel,Myriam Assous,Stephane Moreau,Remi Velard
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1156-1163, (2023)
引用1浏览0EIWOS引用
1
0
Demonstration of a Wafer Level Face- To-Back (F2B) Fine Pitch Cu-Cu Hybrid Bonding with High Density TSV for 3D Integration Applications
Jerzy Javier Suarez Berru,Stephane Nicolas,Nicolas Bresson,Myriam Assous,Stephan Borel
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.97-102, (2023)
引用1浏览0EIWOS引用
1
0
Collective Die-to-Wafer Self-Assembly for High Alignment Accuracy and High Throughput 3D Integration
Alice Bond,Emilie Bourjot,Stephan Borel,Thierry Enot,Pierre Montmeat,Loic Sanchez, Frank Fournel,Johanna Swan
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)pp.168-176, (2022)
引用2浏览0EIWOS引用
2
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作者统计

#Papers: 51

#Citation: 872

H-Index: 21

G-Index: 29

Sociability: 6

Diversity: 2

Activity: 1

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