基本信息
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Bio
Lucile Arnaud joined CEA-LETI, Grenoble, France, in 1984. She first covered design and characterization of magnetic and electromagnetic passive devices. From 2007 to 2014, she was assigned at STMicroelectronics, Crolles, France, for interconnect reliability expertise of most advanced CMOS technology. Since 2014, she has been involved in 3D-IC developments in LETI for technology expertise and projects managing. In the last four years, she managed internal and collaborative projects for 3D interconnects development with Cu-SiO₂ hybrid bonding technologies. She authored or coauthored more than 90 articles, including some invited talks and tutorials in the IEEE conferences.
Research Interests
Papers共 101 篇Author StatisticsCo-AuthorSimilar Experts
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ECS Journal of Solid State Science and Technologyno. 2 (2022)
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)pp.1-2, (2022)
ECS Meeting Abstractsno. 14 (2021): 662-662
Pascal Vivet,Eric Guthmuller,Yvain Thonnart,Gael Pillonnet,Cesar Fuguet,Ivan Miro-Panades,Guillaume Moritz,Jean Durupt,Christian Bernard,Didier Varreau,Julian Pontes,Sebastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frederic Berger,Alain Gueugnot,Alain Greiner,Quentin L. Meunier,Alexis Farcy,Alexandre Arriordaz,Severine Cheramy,Fabien Clermidy
Pascal Vivet,Eric Guthmuller,Yvain Thonnart,Gaël Pillonnet,Guillaume Moritz,Ivan Miro-Panadès,César Fuguet Tortolero,Jean Durupt,Christian Bernard,Didier Varreau,Julian J. H. Pontes,Sebastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frederic Berger,Alain Gueugnot,Alain Greiner,Quentin L. Meunier,Alexis Farcy,Alexandre Arriordaz,Séverine Cheramy,Fabien Clermidy
Pascal Vivet,Eric Guthmuller,Yvain Thonnart,Gael Pillonnet,Guillaume Moritz,Ivan Miro-Panades,Cesar Fuguet,Jean Durupt,Christian Bernard,Didier Varreau,Julian Pontes,Sebastien Thuries,David Coriat,Michel Harrand,Denis Dutoit,Didier Lattard,Lucile Arnaud,Jean Charbonnier,Perceval Coudrain,Arnaud Garnier,Frederic Berger,Alain Gueugnot,Alain Greiner,Quentin Meunier,Alexis Farcy,Alexandre Arriordaz,Severine Cheramy,Fabien Clermidy
2020 IEEE INTERNATIONAL SOLID- STATE CIRCUITS CONFERENCE (ISSCC)pp.46-+, (2020)
Cited28Views0Bibtex
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C. Cavalcante, C. Fenouillet-Beranger,P. Batude,X. Garros,X. Federspiel,J. Lacord,S. Kerdiles,A. S. Royet,P. Acosta-Alba,O. Rozeau,V Barral,F. Arnaud,N. Planes,P. O. Sassoulas,E. Ghegin,R. Beneyton,M. Gregoire,O. Weber,C. Guerin,L. Arnaud,S. Moreau,R. Kies,G. Romano,N. Rambal, A. Magalhaes,G. Ghibaudo,J. P. Colinge,M. Vinet,F. Andrieu
2019 6th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D)pp.11-11, (2019)
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Author Statistics
#Papers: 101
#Citation: 1260
H-Index: 21
G-Index: 32
Sociability: 6
Diversity: 3
Activity: 4
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