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Research Interests

Papers共 103 篇Author StatisticsCo-AuthorSimilar Experts

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Aging Behaviour and Environmental Impact of under Bump Metallurgies for Wafer Level Balling
Arnaud Garnier,Laetitia Castagné,Stéphane Moreau,Alexandra Fraczkiewicz, Théo Monniez,Daniel Mermin, Suzanne Guillou,Laura Vauche,Damien Saint-Patrice,Perceval Coudrain
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1649-1656, (2024)
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Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects
Jun-Ho Choy,Stephane Moreau, Catherine Brunet-Manquat,Valeriy Sukharev,Armen Kteyan
PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024pp.85-90, (2024)
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Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 Nm
S. Lhostis,B. Ayoub, C. Sart,S. Moreau,E. Souchier, M. G. Gusmao Cacho, E. Deloffre,S. Mermoz, C. Rey, F. Le Roux, E. Aybeke, S. Gallois-Garreignot, H. Fremont,A. Tournier
JOURNAL OF ELECTRONIC MATERIALS (2024)
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RC Delay Mitigation for Sub 700 Nm Hybrid Bonding Pitch
Sandrine Lhostis,Bassel Ayoub,Hélène Frémont,Stéphane Moreau,Sebastien Mermoz,Emilie Deloffre,Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke,Patrick Lamontagne, Christelle Rey,Arnaud Tournier
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.396-403, (2023)
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Recent Progress in the Development of High-Density TSV for 3-Layers CMOS Image Sensors
Stephan Borel,Myriam Assous,Stephane Moreau,Remi Velard
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1156-1163, (2023)
Cited1Views0EIWOSBibtex
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Author Statistics

#Papers: 104

#Citation: 843

H-Index: 16

G-Index: 26

Sociability: 6

Diversity: 2

Activity: 8

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