谷歌浏览器插件
订阅小程序
在清言上使用
VIPCreated with Sketch.
研究兴趣

论文共 103 篇作者统计合作学者相似作者

按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
Aging Behaviour and Environmental Impact of under Bump Metallurgies for Wafer Level Balling
Arnaud Garnier,Laetitia Castagné,Stéphane Moreau,Alexandra Fraczkiewicz, Théo Monniez,Daniel Mermin, Suzanne Guillou,Laura Vauche,Damien Saint-Patrice,Perceval Coudrain
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.1649-1656, (2024)
引用0浏览0EIWOS引用
0
0
Warpage Study by Employing an Advanced Simulation Methodology for Assessing Chip Package Interaction Effects
Jun-Ho Choy,Stephane Moreau, Catherine Brunet-Manquat,Valeriy Sukharev,Armen Kteyan
PROCEEDINGS OF THE 2024 INTERNATIONAL SYMPOSIUM ON PHYSICAL DESIGN, ISPD 2024pp.85-90, (2024)
引用0浏览0EI引用
0
0
Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 Nm
S. Lhostis,B. Ayoub, C. Sart,S. Moreau,E. Souchier, M. G. Gusmao Cacho, E. Deloffre,S. Mermoz, C. Rey, F. Le Roux, E. Aybeke, S. Gallois-Garreignot, H. Fremont,A. Tournier
JOURNAL OF ELECTRONIC MATERIALS (2024)
引用0浏览0引用
0
0
RC Delay Mitigation for Sub 700 Nm Hybrid Bonding Pitch
Sandrine Lhostis,Bassel Ayoub,Hélène Frémont,Stéphane Moreau,Sebastien Mermoz,Emilie Deloffre,Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke,Patrick Lamontagne, Christelle Rey,Arnaud Tournier
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.396-403, (2023)
引用0浏览0EIWOS引用
0
0
Recent Progress in the Development of High-Density TSV for 3-Layers CMOS Image Sensors
Stephan Borel,Myriam Assous,Stephane Moreau,Remi Velard
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1156-1163, (2023)
引用1浏览0EIWOS引用
1
0
加载更多
作者统计

#Papers: 104

#Citation: 843

H-Index: 16

G-Index: 26

Sociability: 6

Diversity: 2

Activity: 8

  • 合作者
  • 学生
  • 导师
暂无相似学者，你可以通过学者研究领域进行搜索筛选
数据免责声明
页面数据均来自互联网公开来源、合作出版商和通过AI技术自动分析结果，我们不对页面数据的有效性、准确性、正确性、可靠性、完整性和及时性做出任何承诺和保证。若有疑问，可以通过电子邮件方式联系我们：report@aminer.cn