S. H. Kim - Engineering Ceramic Center, Korea Institute of Ceramic Engineering and Technology

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个人简介

Seonhong Kim received the B.S. degree in electrical engineering from Inha University, Incheon, South Korea, in 2011. He joined the DRAM Design Division, SK Hynix, Incheon, in 2012, where he has worked on analog circuit design and temperature sensor in the Circuit Design Team. He was involved in the circuit design of low-power mobile DRAM.

研究兴趣

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Characteristics of the Discoloration Switching Phenomenon of 4H-Sic Single Crystals Grown by PVT Method Using ToF-SIMS and Micro-Raman Analysis

Seul-Ki Kim, Hajun Kim,Hyun Sik Kim,Tae Eun Hong,Younki Lee,Eun Young Jung

MATERIALSno. 5 (2024)

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Improving Key-Value Cache Performance with Heterogeneous Memory Tiering: A Case Study of CXL-based Memory Expansion

KyungSoo Lee,Sohyun Kim, Joohee Lee,Donguk Moon, Rakie Kim, Honggyu Kim, Hyeongtak Ji, Yunjeong Mun,Youngpyo Joo

IEEE Microno. 99 (2024): 1-11

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13.4 A 48GB 16-High 1280gb/s HBM3E DRAM with All-Around Power TSV and a 6-Phase RDQS Scheme for TSV Area Optimization

Jinhyung Lee,Kyungjun Cho,Chang Kwon Lee,Yeonho Lee,Jae-Hyung Park,Su-Hyun Oh,Yucheon Ju,Chunseok Jeong,Ho Sung Cho,Jaeseung Lee,Tae-Sik Yun,Jin Hee Cho,Sangmuk Oh,Junil Moon,Young-Jun Park, Hong-Seok Choi,In-Keun Kim,Seung Min Yang,Sun-Yeol Kim,Jaemin Jang, Jinwook Kim,Seong-Hee Lee,Younghyun Jeon,Juhyung Park, Tae-Kyun Kim,Dongyoon Ka,Sanghoon Oh, Jinse Kim,Junyeol Jeon,Seonhong Kim,Kyeong Tae Kim,Taeho Kim, Hyeonjin Yang, Dongju Yang, Minseop Lee,Heewoong Song,Dongwook Jang,Junghyun Shin, Hyunsik Kim, Changki Baek, Hajun Jeong, Jongchan Yoon,Seung-Kyun Lim,Kyo Yun Lee,Young Jun Koo,Myeong-Jae Park,Joohwan Cho, Jonghwan Kim

2024 IEEE International Solid-State Circuits Conference (ISSCC)（2024）

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13.1 A 35.4Gb/s/pin 16Gb GDDR7 with a Low-Power Clocking Architecture and PAM3 IO Circuitry

Jaehyeok Yang,Hyeongjun Ko,Kyunghoon Kim, Hyunsu Park,Jihwan Park,Ji-Hyo Kang,Jin-Youp Cha,Seongjin Kim,Youngtaek Kim, Minsoo Park,Gangsik Lee,Keonho Lee, Sanghoon Lee, Gyunam Jeon,Sera Jeong,Yongsuk Joo,Jaehoon Cha, Seonwoo Hwang,Boram Kim,Sang-Yeon Byeon, Sungkwon Lee, Hyeonyeol Park,Joohwan Cho, Jonghwan Kim

IEEE International Solid-State Circuits Conference（2024）

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Fabrication and Characterization of Al2O3-Siloxane Composite Thermal Pads for Thermal Interface Materials

Seul-Ki Kim,Yeong-Jin Koo,Hyun Sik Kim, Jong-Keun Lee, Kyounghoon Jeong,Younki Lee,Eun Young Jung

Materialsno. 4 (2024): 914-914

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System Optimization of Data Analytics Platforms using Compute Express Link (CXL) Memory

Seokhyun Ryu,Sohyun Kim, Jaeyung Jun,Donguk Moon, Kyungsoo Lee,Jungmin Choi,Sunwoong Kim, Hyungsoo Kim, Luke Kim,Won Ha Choi, Moohyeon Nam,Dooyoung Hwang,Hongchan Roh,Youngpyo Joo

BigComppp.9-12, (2023)

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A Workfunction Engineered Middle-Silicon-TiN Gate (MSTG) Cell Transistor in 16Gbit DRAM for High Scalability and Long Data Retention

Seong-Wan Ryu,Kyung Kyu Min, Sunghwan Hwang, Hyunmin Seung, Sungsoo Yoon, Yoonjae Nam,Jungmin Moon, Yaeji Kim, Euntae Kim, Jongkook Park, Kyoungchul Jang, Sinwoo Kang, Taekyun Kim,Seonsoon Kim, Ilsup Jin,Seonyong Cha

2023 International Electron Devices Meeting (IEDM)pp.1-4, (2023)

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Purity Evaluation of Highly Oriented Cubic Silicon Carbide Using Micro-Raman Spectroscopy

Seul-Ki Kim,Eun Young Jung,Myung-Hyun Lee

Trans. Electr. Electron. Mater.（2022）

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Defect-Induced Luminescence Quenching of 4H-SiC Single Crystal Grown by PVT Method through a Control of Incorporated Impurity Concentration

Seul-Ki Kim,Eun Young Jung,Myung-Hyun Lee

Compoundsno. 1 (2022): 68-79

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