Ra-Min Tain

Ra-Min Tain received the Ph.D. degree in mechanical engineering from the University of Ottawa, Ottawa, ON, Canada, in 1995. He was with the Industrial Technology Research Institute, Hsinchu, Taiwan, from 2003 to 2013. He is currently the Deputy Director of New Business Development with Unimicron Technology Corporation, Hsinchu. He is currently involved in research and development of silicon and glass interposers in 2.5-D/3-D IC, advanced packaging modeling, and product development. His current research interests include IC feasibility design, microelectronics device and optoelectronic packaging, and printed-circuit-board thermal solution.