基本信息
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个人简介
Dr. Dyi-Chung Hu, is currently the CEO of SiPlus Co. (www.si2plus.com). Develop semiconductor heterogeneous integration platform and process. Especially die-last solution of "Integrated Substrate". Integrates BEOL, thin film RDL and laminated substrate to be "one" integrated substrate for die-last applications. The solutions developed; 2.0D, 2.1D, 2.2D, and 2.3D with the process and IP protection.
hu@si2plus.com
研究兴趣
论文共 81 篇作者统计合作学者相似作者
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2023 International Conference on Electronics Packaging (ICEP)pp.57-58, (2023)
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.47-52, (2023)
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.175-180, (2023)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
2021 IEEE 71st Electronic Components and Technology Conference (ECTC)pp.157-163, (2021)
Dyi-Chung Hu, James Ho
Proceedings of the International Symposium on Microelectronicsno. 1 (2020): 000156-000159
Dyi-Chung Hu, Hirohito Hashimoto, Li-Fong Tseng,Ken Chau-Cheung Cheng,Katherine Shu-Min Li,Sying-Jyan Wang, Sean Y-S Chen,Jwu E. Chen, Clark Liu,Andrew Huang
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作者统计
#Papers: 81
#Citation: 1239
H-Index: 23
G-Index: 29
Sociability: 5
Diversity: 1
Activity: 0
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