Ching-Kuan Lee

Ching-Kuan Lee received the Ph.D. degree in chemistry from Fu Jen Catholic University, Taipei, Taiwan, in 2001. She has been with the Industrial Technology Research Institute (ITRI), Material and Chemical Research Laboratories, Hsinchu, Taiwan, since 2003, and moved to the Electronics and Optoelectronic Research Laboratories, ITRI, as a member of the Division of Packaging Technology in 2006, where she is mainly responsible for microbumping process. She is currently a Researcher with ITRI. Her current research interests include chemical metallization process and process development of advanced package technology.