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Research Interests

Papers共 28 篇Author StatisticsCo-AuthorSimilar Experts

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Development and Characterizations of Fine Pitch Flip-Chip Interconnection Using Silver Sintering
Julie Gougeon, Jean-Charles Souriau,Laurent Mendizabal,Céline Feautrier,R. Franiatte,Mona Tréguer‐Delapierre,Edouard Deschaseaux
Proceedings of the International Symposium on Microelectronicsno. EMPC (2024)
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Hybrid PMUT Realized Using an Innovative “Piezo-in-flex” Technology
F. Casset, A. Rascle, C. Prat, L. Gerfault,S. Brulais, L. Peris y Saborit, R. Perrier,D. Mermin,R. Franiatte, M. Kazar Mendes, R. Liechti, M. Colin
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-4, (2024)
Cited0Views0EIWOSBibtex
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3D Integration for Power MOS H Bridge Power Application
J. Charbonnier,M. Assous, J. P. Bally,A. Plihon,T. Hilt, A. Hassaine,T. Mourier, C. Brunet Manquat,R. Franiatte, J. Guillaume,C. Hartler,J. Siegert,F. Schrank, K. Pressel, H. Gruber
2016 6th Electronic System-Integration Technology Conference (ESTC) (2016)
Cited2Views0EIWOSBibtex
2
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Stacking of 3D Capacitor Chips in a Package for a Compact and Reliable Component Working at High Temperature
Stephan Borel, P. Descours, B. Goubault, P. Nicolas,R. Franiatte,G. Parat, M. Pommier, S. Yon, G. Simon,C. Bunel
Additional conferences (Device packaging, HiTEC, HiTEN, & CICMT)no. DPC (2016): 001948-001966
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Heat Spreading Packaging Solutions for Hybrid Bonded 3D-Ics
R. Prieto,P. Coudrain,J. P. Colonna, Y. Hallez, C. Chancel, V. Rat, S. Dumas, G. Romano,R. Franiatte, C. Brunet-Manquiat,S. Cheramy,A. Farcy
2016 IEEE International 3D Systems Integration Conference (3DIC) (2016)
Cited2Views0Bibtex
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Author Statistics

#Papers: 28

#Citation: 171

H-Index: 8

G-Index: 12

Sociability: 5

Diversity: 1

Activity: 0

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