Perceval Coudrain

Perceval Coudrain received the M.S. degree in materials sciences from the University of Nantes, Nantes, France, in 2001, and the Ph.D. degree from the Institut Supérieur de ’Aéronautique et de l’Espace, Toulouse, France, in 2009. He joined STMicroelectronics, Crolles, France, in 2002, and entered the advanced research and development group in 2005, where he was involved in the development of backside illumination and monolithic 3D integration for CMOS image sensors. For ten years, he has been focusing on 3D integration technologies, including TSV and C–Cu hybrid bonding, and thermal management. He moved to CEA-Leti, Grenoble, France, in 2018, where his research focuses on 3D integration, fan-out wafer level packaging, and embedded microfluidics.