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    • Research Interests
    Emerging Technologie...Emerging TechnologiesPore SealingLayoutDtcoInterconnect202020112025
    20112024

    Papers共 71 篇Patents共 122 篇Author StatisticsCo-AuthorSimilar Experts

    By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
    时间
    引用量
    主题
    期刊级别
    合作者
    合作机构
    All20242023202220212020201920182017201620152014201320122011201020092008
    Front-side Integration of Middle-of-line Stacked Contacts for Monolithic CFET
    2024 IEEE International Interconnect Technology Conference (IITC)pp.1-3, (2024)
    Cited0Views1EIWOSBibtex
    0
    1
    Area-Efficient CFET Dual-port SRAM with Backside Interconnect
    D. Abdi,M. Brunion, F. Garcia-Redondo,P. Weckx,J. Boemmels, L. Verschueren,A. Farokhnejad,M. Garcia-Bardon,G. Hellings,J. Ryckaert
    2024 50TH IEEE EUROPEAN SOLID-STATE ELECTRONICS RESEARCH CONFERENCE, ESSERC 2024pp.21-24, (2024)
    Cited0Views0EIWOSBibtex
    0
    0
    MOL Patterning Challenges in Scaled SRAM with Vertical Surrounding Gate Transistors (SGT)
    Advanced Etch Technology and Process Integration for Nanopatterning XI (2022)
    Cited1Views30Bibtex
    1
    30
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    Author Statistics
    00.20.40.60.81#Papers#CitationH-IndexG-IndexSociabilityDiversityActivity

    #Papers: 69

    #Citation: 815

    H-Index: 19

    G-Index: 27

    Sociability: 6

    Diversity: 2

    Activity: 0

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    • 合作者
    • 学生
    • 导师
    Zsolt Tokei合作论文数
    22
    Julien Ryckaert合作论文数
    IMEC21
    Katia Devriendt合作论文数
    13
    Nancy Heylen合作论文数
    13
    Steven Demuynck合作论文数
    12
    D. Mocuta合作论文数
    imec10
    Lieve G. Teugels合作论文数
    imec10
    Kristof Croes合作论文数
    Imec9
    Erik Rosseel合作论文数
    8
    Jean-Francois de Marneffe合作论文数
    8
    Arindam Mallik合作论文数
    Northwestern University;Electrical Engineering and Computer Sc. Department8
    N. Horiguchi合作论文数
    7
    Zs. Tokei合作论文数
    7
    Ivan Ciofi合作论文数
    7
    Christopher J. Wilson合作论文数
    7
    Mikhail Baklanov合作论文数
    North China University of Technology7
    B. T. Chan合作论文数
    6
    N. Jourdan合作论文数
    6
    Trong Huynh-Bao合作论文数
    6
    B. Briggs合作论文数
    6
    F. Sebaai合作论文数
    6
    waikin li合作论文数
    6
    Jerome Mitard合作论文数
    Imec6
    Pieter Weckx合作论文数
    IMEC6
    Philippe Matagne合作论文数
    Mission College, Intel Corporation6
    Geert Mannaert合作论文数
    6
    D. Radisic合作论文数
    5
    markus nopper合作论文数
    5
    Nouredine Rassoul合作论文数
    5
    Herbert Struyf合作论文数
    5
    Nadine Collaert合作论文数
    Imec5
    Janko Versluijs合作论文数
    5
    Stefan Decoster合作论文数
    5
    Yong Kong Siew合作论文数
    5
    Anabela Veloso合作论文数
    5
    E. Vecchio合作论文数
    4
    Sujith Subramanian合作论文数
    4
    Zhicheng Wu合作论文数
    4
    Christophe Lorant合作论文数
    4
    G. Jamieson合作论文数
    4
    Frederic Lazzarino合作论文数
    IMEC4
    Anshul Gupta合作论文数
    imec4
    Patrick Verdonck合作论文数
    4
    Clement Porret合作论文数
    Imec Vzw, Kapeldreef 75, B-3001 Leuven, Belgium4
    Edouard Giacomin合作论文数
    Univ Utah, Dept Elect & Comp Engn, Salt Lake City, UT 84112 USA4
    Nicolas Jourdan合作论文数
    4
    Jacopo Franco合作论文数
    IMEC4
    Anne Vandooren合作论文数
    4
    Dmitry Batuk合作论文数
    EMAT, University of Antwerp4
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