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论文共 240 篇作者统计合作学者相似作者

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Q-factor Improvement of Surface Ion Trap Fabrication
H. Y. Li, Morteza Ahmadi, Huihong Clarence Liu,Norhanani Jaafar, Mishra Dileep,Simon Chun Kiat Goh, YanYan Zhou,Manas Mukherjee
QUANTUM COMPUTING, COMMUNICATION, AND SIMULATION IV (2024)
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Design and Fabrication of 2.5D Cryogenic Interposer with Integrated Superconducting TSVs and Resonators
HongYu Li,King-Jien Chui,Simon Chun Kiat Goh,Rangga Perdana Budoyo,Nguyen Hoang Long,Yong Chyn Ng, Daniel Lau, B. N. Jaafar,Yuanzheng Paul Tan,Rainer Dumke
PROCEEDINGS OF THE IEEE 74TH ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTC 2024pp.458-463, (2024)
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Damascene Compatible Low Thermal Budget Fine-Pitch Copper Hybrid Boding with Ultra-Thin Surface Passivation
Hemanth Kuamr Cheemalamarri,Gim Guan Chen,Hongyu Li, Chandra Rao Bhesetti,Nagendra Sekhar Vasarla,Nandini Venkataraman,King Jien Chui,Srinivasa Rao Vempati,Navab Singh
Extended Abstracts of the 2023 International Conference on Solid State Devices and Materials (2023)
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Alignment Through Thick Si Layer for High Resolution Patterning on Bonded Wafers with Tight Overlay Margin Using Immersion Lithography
Arvind Sundaram,Chin Khang Tew, Guo Wei Tan,Yuan-Hsing Fu,Hongyu Li,Nandini Venkataraman, Bhesetti Chandra Rao,Navab Singh
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.1150-1155, (2023)
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作者统计

#Papers: 251

#Citation: 2522

H-Index: 25

G-Index: 38

Sociability: 7

Diversity: 3

Activity: 26

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