Investigation of SnAg Superconductivity as Solder Material for Cryogenic Packaging
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)（2023）
关键词
Superconductivity,Solder Material,Assembly Process,Critical Temperature,Critical Temperature Tc,Flip-chip,Superconducting Properties,Chemical Vapor Deposition,Quantum State,Quantum Information,Electroplating,Cryogenic Temperatures,Suitability For Applications,Physical Vapor Deposition,Cryogenic Conditions,Dilution Refrigerator,Heterogeneous Integration,Metal Lines
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