Cornelia K. Tsang

Cornelia K. Tsang received the B.S. and M.S. degrees in materials science and engineering from the Massachusetts Institute of Technology, Cambridge, MA, in 2000 and 2001, respectively. She is currently a Senior Engineer at the IBM Thomas J. Watson Research Center, Yorktown Heights, NY. Since joining the IBM Research Division in 2001, she has been in the System-on-Package/3D Integration Group, where she is involved in novel process development and integration of silicon-based packages and 3-D chip stacks. She has contributed to the implementation of through-silicon vias (TSV) in IBM's SiGe technology, used in RF power amplifier applications. She is the author or coauthor of more than 30 papers published in journals or conference proceedings, and is the holder of more than 35 issued or pending patents. Her research interests include TSV technology, silicon carrier integration, 3-D integrated circuits, chip stacking, and wafer-level bonding. Ms. Tsang is the recipient of the 2008 National Women of Color Rising Star of Technology Award and has also received an IBM Research Division Award.