Michael a Gaynes

Michael A. Gaynes received the B.S. degree in chemical engineering from Brigham Young University, Provo, UT, USA. He joined IBM, Endicott, NY, USA, in 1979. He has held technical leadership positions that cover a wide spectrum of electronic packaging in manufacturing and development. These include ceramic chip carrier circuitization, failure analysis, reliability test and model development, flip-chip organic packaging design and process development, adhesive development, and adhesion science. From 1990 to 2003, he directed materials and process development efforts for applications that required thermally and electrically conductive adhesives, die attach adhesives, and flip-chip underfills. He joined the IBM Research T. J. Watson Research Center, Yorktown Heights, NY, USA, in 2003, as a Senior Technical Staff Member, where he provided leadership in developing process and adhesive solutions needed for next-generation electronic packages. He is currently a Process Research Engineer with the Area Array Consortium, Universal Instruments, Inc., Conklin, NY, USA. He has coauthored 46 technical publications and holds 130 U.S. patents issued.