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Elevated-Epi (elepi) Technique for 3D IC with Stacked FinFETs, Interlevel Metal, and 25 $\times$ 33 Mm$^{\text{2}}$ Single-Crystalline Silicon on SiO$_\text{2}$
Bo-Jheng Shih,Yu-Ming Pan,Hao-Tung Chung, Chieh-Ling Lee, I-Chun Hsieh, Nein-Chih Lin,Chih-Chao Yang, Po-Tsang Huang,Hung-Ming Chen, Chiao-Yen Wang, Huan-Yu Chiu, Huang-Chung Cheng,Chang-Hong Shen,Kuan-Neng Chen,Chenming Hu
IEEE Transactions on Electron Devicespp.1-6, (2024)
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Effects of Channel Thickness on DC/RF Performance of InAlGaN/AlN/GaN HEMTs
De Shieh, Zheng-Fong Lee, Ming-Yuan Lee,Hui-Yu Chen,Chang-Yan Hsieh,Po-Tsung Tu,Po-Chun Yeh,Shyh-Shyuan Sheu,Wei-Chung Lo,Shih-Chieh Chang,Chang-Hong Shen,Jia-Min Shieh,Jen-Inn Chyi
2024 International VLSI Symposium on Technology, Systems and Applications (VLSI TSA)pp.1-2, (2024)
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Large-Area Single-Crystal Ge Using Elevated Epitaxy Technique for Monolithic 3D Integration
Yu-Ming Pan, Huan-Yu Chiu, Nien-Chih Lin, Hao-Tung Chung, Bo-Jheng Shih, Chiao-Yen Wang, Chih-Chao Yang, Po-Tsang Huang,Chang-Hong Shen, Po-Jung Sung, Wen-Fa Wu,Kuan-Neng Chen,Chenming Hu
Extended Abstracts of the 2024 International Conference on Solid State Devices and Materials (2024)
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Elevated-Epi (elepi) Technique for 3D IC with Stacked FinFETs, Interlevel Metal, and 25 $\times$ 33 Mm $^{\text{2}}$ Single-Crystalline Silicon on SiO $_\Text{2}$
Bo-Jheng Shih,Yu-Ming Pan,Hao-Tung Chung, Chieh-Ling Lee, I-Chun Hsieh, Nein-Chih Lin,Chih-Chao Yang, Po-Tsang Huang,Hung-Ming Chen, Chiao-Yen Wang, Huan-Yu Chiu, Huang-Chung Cheng,Chang-Hong Shen,Kuan-Neng Chen,Chenming Hu
IEEE Transactions on Electron Devicesno. 99 (2024): 1-6
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作者统计

#Papers: 139

#Citation: 1789

H-Index: 24

G-Index: 35

Sociability: 6

Diversity: 3

Activity: 23

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