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Research Interests

Papers共 7 篇Author StatisticsCo-AuthorSimilar Experts

By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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期刊级别
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Optimization And Validation Of A Package And Motherboard Decoupling Strategy
David Auchere,Xavier Lecoq,Yvon Imbs
2016 6TH ELECTRONIC SYSTEM-INTEGRATION TECHNOLOGY CONFERENCE (ESTC)pp.1-5, (2016)
Cited0Views0EIWOSBibtex
0
0
STMicroelectronics package design rules Check coverage enhancement with Cadence Ravel
G Bouteloup, O Franiatte, M Gracietti,Y Imbs,J Jaklic, B Lindberg, Jerome Lopez, D Signoret
European Microelectronics Packaging Conference（2013）
Cited23Views0EIWOSBibtex
23
0
Bga Packages Classification To Reach Esd Cdm Standards
David Auchere, Gerald Afflard, Blaise Jacquier, Stephan Jeune, Corinne Richier,Alexandre Dray, Celine Roussel, David Aleo, Eric Picolet, Cedric Le Borgne,Yvon Imbs, Laurent Marechal
2013 EUROPEAN MICROELECTRONICS PACKAGING CONFERENCE (EMPC)（2013）
Cited22Views0EIWOSBibtex
22
0
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