基本信息
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职业迁徙
个人简介
Yongjin Wu received the M.S. degree in material engineering from the University of Science and Technology of China, Hefei, China, in 2016. He is currently pursuing the Ph.D. degree in electronic science and technology with Shanghai Jiao Tong University, Shanghai, China.
His research interests include the micro-electromechanical system (MEMS)-based hydrogen sensor and microchannel heat sink.
研究兴趣
论文共 20 篇作者统计合作学者相似作者
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期刊级别
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JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2024): 7429-7439
2024 25th International Conference on Electronic Packaging Technology (ICEPT)pp.1-5, (2024)
IEEE SENSORS JOURNALno. 7 (2024): 9573-9584
2024 IEEE 74th Electronic Components and Technology Conference (ECTC)pp.722-726, (2024)
Yongjin Wu, Changbei Ma,Jiangbo Luo, Yunnan Sun,Dongdong Xie,Guifu Ding,Yan Wang,Zhuoqing Yang, Kai Wang,Shengnan Shen
2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT (2023)
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作者统计
#Papers: 21
#Citation: 79
H-Index: 6
G-Index: 8
Sociability: 4
Diversity: 2
Activity: 16
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