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论文共 15 篇作者统计合作学者相似作者

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Microstructure and Intermetallic Growth Characteristics of Sn-Bi-In-xGa Quaternary Low Melting Point Solders
Jingyu Qiao,Xingchao Mao,King-Ning Tu,Yingxia Liu
2024 International Conference on Electronics Packaging (ICEP)pp.13-14, (2024)
引用0浏览0EIWOS引用
0
0
Low melting point SnBiIn-based micro-nanoparticles for high-density microbump bonding technology
Xingchao Mao, Yulong Chen,King-Ning Tu,Yingxia Liu
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.369-372, (2023)
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0
0
A High-Remelting-point Interconnect Method Based on Porous Copper and Sn42Bi58 Solder
Jianqiang Wang,Haozhong Wang,Ziwen Lv,Xiangxiang Zhong,Xingchao Mao,Hongtao Chen
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022)
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0
0
The Analysis of IGBT Module Based on Thermal Simulation Technology
Jiahao Liu, Kun Zhang,Hui Xiao,Gang Zhu,Xingchao Mao,Weiwei Zhang,Fangzhou Chen,Xiaotong Guo, Hao Liu
2022 23rd International Conference on Electronic Packaging Technology (ICEPT) (2022)
引用1浏览0EIWOS引用
1
0
A Novel Non-destructive Failure Location method for electronic components based on TDR technology
Jiahao Liu, Zhi Lin,Xingchao Mao,Hui Xiao,Fangzhou Chen,Weiwei Zhang, Hao Liu,Xiaotong Guo,Jianqiang Wang
2022 23rd International Conference on Electronic Packaging Technology (ICEPT)pp.1-3, (2022)
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作者统计

#Papers: 15

#Citation: 6

H-Index: 1

G-Index: 2

Sociability: 4

Diversity: 1

Activity: 4

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