Wen-Wei Shen

Wen-Wei Shen received the M.S. degree in physics from Chung Yuan Christian University, Taiwan. He is currently pursuing the Ph.D. degree with the Institute of Electronics Engineering, National Chiao Tung University, Hsinchu, Taiwan. In 2007, he served with Taiwan Semiconductor Manufacturing Company, Hsinchu, as the Project Leader Engineer in process integration. Since 2012, he has been serving with the Electronics and Optoelectronic System Research Laboratories, Industrial Technology Research Institute, Hsinchu, where he is currently a Senior Engineer with the Packaging Technology Division. His research interests focus on through-silicon via, 3-D/2.5-D IC electronic packaging, fan-out wafer level package technologies, and heterogeneous integration.