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职业迁徙
个人简介
Tianshu Hou received the B.S. degree in electronic information science and technology from Sichuan University, Chengdu, Sichuan, China, in 2019. She is currently pursuing the Ph.D. degree with the Department of Micro/Nano-Electronics, Shanghai Jiao Tong University, Shanghai, China.
Her current research interests include electromigration reliability modeling, assessment, and optimization.
研究兴趣
论文共 11 篇作者统计合作学者相似作者
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29TH ASIA AND SOUTH PACIFIC DESIGN AUTOMATION CONFERENCE, ASP-DAC 2024pp.746-751, (2024)
2024 2nd International Symposium of Electronics Design Automation (ISEDA)pp.410-415, (2024)
International Conference on ASICpp.1-4, (2023)
IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systemsno. 12 (2023): 4959-4972
ACM transactions on design automation of electronic systemsno. 4 (2023): 1-20
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作者统计
#Papers: 10
#Citation: 25
H-Index: 3
G-Index: 5
Sociability: 3
Diversity: 2
Activity: 14
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