按年份排序按引用量排序主题筛选期刊级别筛选合作者筛选合作机构筛选
时间
引用量
主题
期刊级别
合作者
合作机构
2024 International Conference on Electronics Packaging (ICEP)pp.1-2, (2024)
EIWOS
0
0
IEEE TRANSACTIONS ON DEVICE AND MATERIALS RELIABILITYno. 1 (2024): 142-153
EIWOS
0
0
Micromachinesno. 7 (2023): 1356-1356
WOS
0
0
IEEE 72ND ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC 2022)pp.2128-2134, (2022)
EIWOS
2
0
2022 International Conference on Electronics Packaging (ICEP)pp.159-160, (2022)
EIWOS
0
0
2022 International Symposium on VLSI Technology, Systems and Applications (VLSI-TSA)pp.1-2, (2022)
EIWOS
1
0
2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)pp.55-56, (2022)
EIWOS
0
0
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