Characteristic Analysis of a Multi-chip Embedded Interposer Carrier Using a Wafer- Level Fan-Out Process

Ching Kuan Lee, Wen-Hung Liu, Shu-Yi Chang,Ren-Shin Cheng,Yu-Min Lin,Hsiang-En Ding,Wei-Lan Chiu,Tao-Chih Chang,Chia-Hsin Lee,Chang-Chun Lee

2022 INTERNATIONAL CONFERENCE ON ELECTRONICS PACKAGING (ICEP 2022)（2022）

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Embedded Interposer Carrier,fan-out process,multichip

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