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论文共 192 篇作者统计合作学者相似作者

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Reduced-Order Model for Solder Balls – Potential of Projection-Based Approaches for Representing Viscoplastic Behavior
Mike Feuchter, Hanna Baumgartl, Martin Hanke,Sven Rzepka,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
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Investigation of an Approach for the Determination of the Current State-of-Health and Improvement of Service Life in Power Modules
Jain Chacko, Heiner Moeller,Kshitij Anil Kolas,Jan Albrecht,Sven Rzepka
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
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Solder Fatigue Analyses and Predictions for PCB Mounted Components after Thirteen Years of Thermal Field Cycling
Rainer Dudek,Ralf Döring, Kerstin Kreyßig,Sven Rzepka,Peter Fruehauf, Andreas Weigert
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-13, (2024)
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A Data-driven Condition Monitoring Method to Predict the Remaining Useful Life of SiC Power Modules for Traction Inverters
Giovanni Di Nuzzo,Horst Lewitschnig, Marc Tuellmann,Sven Rzepka,Alexander Otto
2023 IEEE International Conference on Prognostics and Health Management (ICPHM)pp.312-319, (2023)
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Study of Power Cycling Tests Superimposed with Passive Thermal Cycles on IGBT Modules
Alexander Otto,Xing Liu, Rico Eichhorn,Thomas Basler,Josef Lutz,Sven Rzepka
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-10, (2023)
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Mission Profile Related Design for Reliability for Power Electronics Based on Finite Element Simulation
Jan Albrecht, Tobias Horn, Sönke Habenicht,Sven Rzepka
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.722-726, (2023)
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Failure Prediction and Analysis of an IGBT Module for Industrial Applications Subjected to Passive and Power Cycling
Rainer Dudek,Alexander Otto,Ralf Doering,Anu Mathew,Xing Liu,Sven Rzepka
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systemspp.1-11, (2023)
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Improving the Production Quality and Robustness of a SO16 Sensor Package by a Simulation Based Digital Twin Approach
Heiner Moeller,Heiko Knoll, Pascal Hille,Rainer Dudek,Sven Rzepka
2022 IEEE 9th Electronics System-Integration Technology Conference (ESTC) (2022)
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作者统计

#Papers: 193

#Citation: 1369

H-Index: 23

G-Index: 29

Sociability: 6

Diversity: 2

Activity: 8

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