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论文共 39 篇作者统计合作学者相似作者
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2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-8, (2024)
2024 IEEE INTERNATIONAL CONFERENCE ON PROGNOSTICS AND HEALTH MANAGEMENT, ICPHM 2024pp.336-347, (2024)
IECONpp.1-7, (2023)
2023 IEEE International Conference on Prognostics and Health Management (ICPHM)pp.312-319, (2023)
2023 PROGNOSTICS AND HEALTH MANAGEMENT CONFERENCE, PHMpp.47-54, (2023)
PCIM Europe 2023; International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1-10, (2023)
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systemspp.1-11, (2023)
JOURNAL OF ELECTRONIC PACKAGINGno. 2 (2022)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-8, (2022)
2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE) (2022)
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作者统计
#Papers: 38
#Citation: 128
H-Index: 7
G-Index: 10
Sociability: 5
Diversity: 1
Activity: 1
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