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个人简介
Shuibao Liang (Member, IEEE) received the B.E. degree from the Wuhan University of Science and Technology, Wuhan, China, in 2012, and the Ph.D. degree from the South China University of Technology, Guangzhou, China, in 2019.
From 2019 to 2022, he was a Research Associate with the Wolfson School of Mechanical, Electrical, and Manufacturing Engineering, Loughborough University, Loughborough, U.K. In 2023, he joined the Hefei University of Technology, Hefei, China, as an Associate Professor. His current research interests include reliability analysis of electronic packaging and manufacturing, modeling of the microstructure evolution and performance degradation of electrical interconnects under multiphysics loadings.
研究兴趣
论文共 59 篇作者统计合作学者相似作者
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2024 International Conference on Electronics Packaging (ICEP)pp.159-160, (2024)
2024 25th International Conference on Electronic Packaging Technology (ICEPT)pp.1-4, (2024)
JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T (2024): 4152-4161
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 1 (2024): 192-199
2024 International Conference on Electronics Packaging (ICEP)pp.161-162, (2024)
IEEE TRANSACTIONS ON ELECTRON DEVICESno. 9 (2024): 5603-5608
Zenodo (CERN European Organization for Nuclear Research) (2023)
Surfaces and Interfaces (2023): 102728
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作者统计
#Papers: 59
#Citation: 194
H-Index: 8
G-Index: 10
Sociability: 4
Diversity: 2
Activity: 24
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