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论文共 111 篇作者统计合作学者相似作者

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Contact Resistivity of Submicron Hybrid Bonding Pads Down to 400 Nm
S. Lhostis,B. Ayoub, C. Sart,S. Moreau,E. Souchier, M. G. Gusmao Cacho, E. Deloffre,S. Mermoz, C. Rey, F. Le Roux, E. Aybeke, S. Gallois-Garreignot, H. Fremont,A. Tournier
JOURNAL OF ELECTRONIC MATERIALS (2024)
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RC Delay Mitigation for Sub 700 Nm Hybrid Bonding Pitch
Sandrine Lhostis,Bassel Ayoub,Hélène Frémont,Stéphane Moreau,Sebastien Mermoz,Emilie Deloffre,Emeline Souchier, Maria Gabriela Gusmão Cacho, Ece Aybeke,Patrick Lamontagne, Christelle Rey,Arnaud Tournier
2023 IEEE 25th Electronics Packaging Technology Conference (EPTC)pp.396-403, (2023)
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Reliability of the Hybrid Bonding Level Using Submicrometric Bonding Pads
S. Lhostis,B. Ayoub,H. Fremont,S. Moreau,J. G. Mattei,P. Lamontagne,A. Tournier
Microelectronics reliability/Microelectronics and reliability (2023): 115189-115189
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Advanced Electron Energy Loss Spectroscopy Investigation of Microelectronic Devices
J. G. Mattei, R. Bon,B. Ayoub,S. Lhostis, L. Clement
2023 IEEE INTERNATIONAL INTERCONNECT TECHNOLOGY CONFERENCE, IITC AND IEEE MATERIALS FOR ADVANCED METALLIZATION CONFERENCE, MAM, IITC/MAM (2023)
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Sub $1\ \mu \mathrm{m}$ Pitch Achievement for Cu/SiO2 Hybrid Bonding
Bassel Ayoub,Sandrine Lhostis,Stephane Moreau,Emeline Souchier,Emilie Deloffre,Sebastien Mermoz, Maria Gabriela Gusmao Cacho, Norah Szekely, Christelle Rey, Ece Aybeke,Victor Gredy,Patrick Lamontagne,Olivier Thomas,Helene Fremont
2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (2022)
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作者统计

#Papers: 111

#Citation: 2014

H-Index: 23

G-Index: 42

Sociability: 6

Diversity: 2

Activity: 4

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