Reliability of the Hybrid Bonding Level Using Submicrometric Bonding Pads

S. Lhostis,B. Ayoub,H. Fremont,S. Moreau,J. G. Mattei,P. Lamontagne,A. Tournier

Microelectronics reliability/Microelectronics and reliability（2023）

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关键词

3D integration,3D stacked CIS,Hybrid bonding,Fine pitch,Reliability of interconnects,Interface barrier,Cu2O,TC,HTS,Cu diffusion,BTS/TVS,TDDB,Electromigration

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