Philip X.-L. Feng (Senior Member, IEEE) received the Ph.D. degree in electrical engineering (EE) from the California Institute of Technology (Caltech), Pasadena, CA, USA, in 2007. He is currently a Professor with the Department of Electrical and Computer Engineering, University of Florida, Gainesville, FL, USA. He has mentored/co-mentored 13 Ph.D. students to successful dissertation defense, mentored eight postdoctoral scholars, and also supervised 15 M.S. students with theses or research projects. His research is primarily focused on emerging solid-state devices and systems, particularly nano/microelectromechanical systems (NEMS/MEMS), atomic layer semiconductors and 2-D heterostructure devices, silicon carbide (SiC) and other wide/ultrawide-bandgap (WBG/UWBG) semiconductors, quantum devices based on SiC and 2-D materials, as well as their integration with state-of-the-art ICs and optical/photonic technologies. Dr. Feng was an invited participant to the National Academy of Engineering (NAE) U.S. Frontiers of Engineering (USFOE) Symposium in 2013 and subsequently a recipient of the NAE Grainger Foundation Frontiers of Engineering (FOE) Award in 2014. His awards also include the National Science Foundation CAREER Award in 2015 and the Presidential Early Career Award for Scientists and Engineers (PECASE) in 2019. He and his students have won six best paper/presentation awards from IEEE and other international conferences. He has served on the Technical Program Committees (TPCs) for the IEEE International Electron Devices Meeting (IEDM), the IEEE International Conference on Micro Electromechanical Systems (MEMS), the International Conference on Solid-State Sensors, Actuators and Microsystems (Transducers), the International Frequency Control Symposium (IFCS), IEEE Sensors, and other international conferences. He served as the Track Chair for IEEE Sensors from 2016 to 2017 and the TPC Group IV Chair for the IEEE IFCS from 2018 to 2020. He has also served as the Technical Program Chair for the MEMS/NEMS Technical Group from the 61st to 63rd American Vacuum Society (AVS) International Symposium and Exhibition. Since 2017, he has been a Co-Organizer and the Technical Chair of the SiC Materials and Devices Workshop. He has served as the Chair for the 34th IEEE International Conference on Micro Electromechanical Systems (IEEE MEMS 2021). He has also co-organized and co-chaired the Florida Semiconductor Week (FSW) Workshop in January 2023.