By YearBy Citation主题筛选期刊级别筛选合作者筛选合作机构筛选
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期刊级别
合作者
合作机构
IEEE ELECTRON DEVICE LETTERSno. 7 (2024): 1109-1112
EIWOS
0
0
Diffusion and defect data, solid state data Part B, Solid state phenomena/Solid state phenomena (2023): 15-22
0
0
Diffusion and defect data, solid state data Part B, Solid state phenomena/Solid state phenomena (2023): 85-89
1
0
Materials Science Forum (2022): 417-421
2
0
ACS APPLIED ELECTRONIC MATERIALSno. 9 (2022): 4514-4520
2
0
2022 23RD INTERNATIONAL CONFERENCE ON THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS (EUROSIME) (2022)
EIWOS
0
0
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