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论文共 76 篇作者统计合作学者相似作者

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Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers
D. May,B. Wunderle, I. Cirulis, S. Braun,U. Zschenderlein,J. Heilmann,R. Pantou,R. Schacht, R. Rzepka,M. Abo Ras, S. Kurth, H. Kuhn
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
引用0浏览0EIWOS引用
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Corrosion-Compatible Drive Electronics for Electric Vehicles and Industrial Power Modules
Tom Petzold,Ronald Eisele,Markus Bast, Armin Hindel, Bennet Lorbeer, Knud Gripp, Sara Panahandeh,Corinna Grosse-Kockert,Daniel May,Mohamad Abo Ras,Anu Mathew, Susana Richter-Trummer, Rico Eichhorn, Sven Rzepka
PCIM Europe 2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1153-1162, (2024)
引用0浏览0EIWOS引用
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Closed-loop Flow Boiling Cooler Test Stand for Investigations on Future Power Package Designs
Ralph Schacht, Jihed Ben Majed, Tobias Grün,Daniel May,Mohamad Abo Ras,Bernhard Wunderle
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)pp.1-8, (2024)
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Enhancing Defect Detection Using Lock In Thermography
Doaa Mohamed,Daniel May,Kaushal Arun Pareek,Mohamad Abo Ras,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
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Thermal Characterisation and Technology of Intercalated Graphene-Based Nano-Laminates
B. Wunderle, M. Stevens,D. May, E. Dannenberg, S. Hermann, C. Grosse-Kockert,M. Abo Ras, A. Hermannsdorfer, M. Köhne
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)pp.1-8, (2024)
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Full-Field IR-Thermography for Bond-Quality Inspection of Electroplated Aluminium Interconnects for Cryo-SiP Architectures
B. Wunderle,D. May, I. Cirulis, S. Braun,U. Zschenderlein,J. Heilmann, P. Türk,R. Pantou,R. Schacht, R. Rzepka,M. Abo Ras, S. Kurth, H. Kuhn
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-9, (2024)
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Failure Analysis of Sintered Layers in Power Modules Using Laser Lock-in Thermography
S. Panahandeh,D. May,C. Grosse-Kockert,B. Wunderle,M. Abo Ras
International Conference on Thermal, Mechanial and Multi-Physics Simulation and Experiments in Micro-Electronics and Micro-Systemspp.1-7, (2023)
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作者统计

#Papers: 76

#Citation: 310

H-Index: 8

G-Index: 14

Sociability: 5

Diversity: 2

Activity: 3

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