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论文共 104 篇作者统计合作学者相似作者

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CoolStar: A New Approach to Automotive HPC Cooling with Improved Thermo-Mechanical Design
Baris Erol,Daniel May,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-10, (2024)
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Full-Field Through-Chip IR-Thermography-based Quality Testing & Failure Analysis on Electroplated Aluminium Interconnects for Cryogenic Applications in Ion-Trap Quantum Computers
D. May,B. Wunderle, I. Cirulis, S. Braun,U. Zschenderlein,J. Heilmann,R. Pantou,R. Schacht, R. Rzepka,M. Abo Ras, S. Kurth, H. Kuhn
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-8, (2024)
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Corrosion-Compatible Drive Electronics for Electric Vehicles and Industrial Power Modules
Tom Petzold,Ronald Eisele, Markus Bast, Armin Hindel, Bennet Lorbeer, Knud Gripp, Sara Panahandeh,Corinna Grosse-Kockert,Daniel May,Mohamad Abo Ras,Anu Mathew, Susana Richter-Trummer, Rico Eichhorn, Sven Rzepka
PCIM Europe 2024 International Exhibition and Conference for Power Electronics, Intelligent Motion, Renewable Energy and Energy Managementpp.1153-1162, (2024)
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Closed-loop Flow Boiling Cooler Test Stand for Investigations on Future Power Package Designs
Ralph Schacht, Jihed Ben Majed, Tobias Grün,Daniel May, Mohamad Abo Ras, Bernhard Wunderle
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)pp.1-8, (2024)
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Multi-purpose Thermal Test Vehicle for Experimental Investigation on Pumped Two-Phase Cooling
Ralph Schacht, Ben Majed, Tobias Gruen,Daniel May,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-7, (2024)
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Heat Spreading in Uncovered Copper Sintered Die-Attach Layers Examined with Lock-in Thermography
Olaf Rämer, Marek Zajaczkowski, Corinna Grosse-Kockert,Daniel May,Sri Krishna Bhogaraju
2024 IEEE 10th Electronics System-Integration Technology Conference (ESTC)pp.1-6, (2024)
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Enhancing Defect Detection Using Lock In Thermography
Doaa Mohamed,Daniel May,Kaushal Arun Pareek,Mohamad Abo Ras,Bernhard Wunderle
2024 25th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE)pp.1-9, (2024)
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Numerical Investigation of a Novel Lid Design for Automotive HPC Cooling
Baris Erol,Daniel May, Bernhard Wunderle
2024 30th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC)pp.1-10, (2024)
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作者统计

#Papers: 103

#Citation: 506

H-Index: 13

G-Index: 18

Sociability: 6

Diversity: 0

Activity: 2

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