Mehul Naik

Mehul Naik is a Principal Member of the Technical Staff at Applied Materials, Santa Clara, CA, USA. Currently, he leads the Interconnect Program in the Advanced Product and Technology Development Team within the Silicon Systems Group. He has more than 15 years of experience in interconnect technology, and has co-authored over 40 conference and journal publications. He holds 30 U.S. patents covering metallization, low k, process integration, and patterning. He has co-chaired the Advanced Metallization Conference in 2008, and is currently on the executive committee for the Advanced Metallization Conference and the program committee for International Interconnect Technology Conference. He is a member of the Science Area Coordinating Committee for the Interconnect Packaging Science thrust in Semiconductor Research Corporation. Mehul received the Ph.D. degree in chemical engineering from the Rensselaer Polytechnic Institute, Troy, NY, USA.