Kun-Da Chu

Kun-Da Chu (Graduate Student Member, IEEE) received the B.S. degree in electronic engineering from National Taiwan University of Science and Technology, Taipei, Taiwan, in 2005, and the M.S. degree in electronic engineering from National Taiwan University, Taipei, in 2008. He is currently pursuing the Ph.D. degree with the University of Washington, Seattle, WA, USA. From 2008 to 2016, he was a Principal Engineer with the RFIC Design Division, MStar Semiconductor Inc., and MediaTek Inc, Hsinchu, Taiwan, with a focus on RF transceiver circuit design. In 2018, he joined Intel Labs, Hillsboro, OR, USA, as an RFIC Design Intern. His research interests include RF/millimeter-wave (mm-wave) circuits. Mr. Chu was a recipient of the Analog Device Outstanding Student Designer Award in 2018 and 2019.