基本信息
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Career Trajectory
Bio
Ki Wook Jung received the M.S. and Ph.D. degrees from the Department of Mechanical Engineering, Stanford University. He is a Staff Thermal Engineer with the Division of Test and System Package, Samsung Electronics. His research interests include heat transfer and semiconductor package.
Research Interests
Papers共 33 篇Author StatisticsCo-AuthorSimilar Experts
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期刊级别
合作者
合作机构
2023 IEEE 73RD ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE, ECTCpp.192-199, (2023)
Journal of Electronic Packaging (2022)
2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm)pp.1-8, (2022)
2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) (2022)
semanticscholar(2021)
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Author Statistics
#Papers: 33
#Citation: 353
H-Index: 11
G-Index: 18
Sociability: 4
Diversity: 2
Activity: 30
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